The highlighted elements in periodic table can be plated as pure elements and/or compounds
(click on element to see more information)
To learn more about electrochemical deposition processes click ELECTROPLATING and ELECTROLESS PLATING. Our range of Plating Products are presented in STORE. We also provide custom formulations of plating solutions, microfabrication and characterization SERVICES.
Alternative metal deposition processes to Electroplating and Electroless Plating include, Chemical Vapor Deposition (CVD) and Atomic Layer Deposition (ALD) as well as Physical Vapor Deposition (PVD). Click on ALD&CVD CATALOG to get more information on our chemical precursors.
2.5D & 3D high density interconnects (HDI) will have a market of $18.1B by Y2020. eLOCOS(TM) HDI allows for the creation of new chipset architectures, for future generations of mobile- & server-class processors, RF, MEMS, Optical, CIS, IoT devices. eLOCOS(TM) electroless metal photo-patterning technology enables the manufacture of large-area flexible PCB’s with plated through holes aimed at the $15.2B flexible PCB market by Y2020. eLOCOS(TM) controlled expansion metallization of 3D electro-thermal systems enables the devices that can withstand high thermal stress and high temperatures, neccessities for the $75B transportation market.
The global metal finishing chemicals market was valued at USD 9.49 billion in 2017. It is anticipated to expand at a CAGR of 4.5% during Y2019 – Y2025 according to Grand View Research. Rising demand for the plating products can be attributed to the properties of electrochemical deposits, such as resistance to corrosion and wear, hardness and mechanical strength, electrical and thermal conductivity, appearance and reflectivity of metals. In 2017, electroplating emerged as the largest process segment and held approximately 40% of the total market share in terms of revenue. This process is majorly used in automotive (~42%) and electronics plating (~24%). Electroless plating is likely to be the fastest growing process segment based on increasing usage of the process in plating printed circuit boards and consumer durables. In addition, the ability of electroless plating process to provide an even finish without the use of electrical power is expected to drive the market growth.
Electroplating and Electroless Plating for Semiconductor and Microfabrication Applications
Plating of Blind Vias and Through-Holes
Electronic devices are made compact and powerful by packing ever-shrinking components onto integrated circuit boards as densely as possible. Still, there are practical limits to how much processing power can be squeezed onto the classic planar circuit board. 3D integrated circuits will allow manufacturers of electronic components to continue making affordable devices smaller and more powerful. Nano3D Systems eLOCOS(TM) plating solutions can fill blind and through-holes completely, uniformly and efficiently, critical for the wide-scale adaption of 3D integrated circuits.
Electroless metal photo-patterning
3D metallization may be the future, but 2D patterning is not going anywhere. Use eLOCOS(TM) solutions to make thin films for etching, or plate selectively by patterning your substrate at the activation step. Use your own processes or Nano3D Systems’ proprietary catalytic photoresist. Plate high-density features on silicon wafers, glass or polymer substrates. Temperature restrictions? pH problems? Let Nano3D Systems help you to find the right process for your situation.
Need interconnect and coatings on your devices withstand high thermal-mechanical stress? Or tune composition and thermal-mechanical properties of Ni-Fe alloys? Match plated metal CTE to substrate CTE? Let NANO3D Systems help you to produce uniform, low-internal-stress and controlled-expansion nickel iron alloy films deposited on different substrates to fabricate redistribution layers, through silicon vias interconnects, plated though-holes, pillars, bumps, pads, coatings and free standing foils.
Other Plating Applications
Conformal plating of metallic shells on non-metallic particles. Novel nano- and micro-materials with unique properties can be fabricated by conformally plating metals on non-metallic particles. Metal plated graphite particles with low resistivity metals combine low electrical resistance with low weight while metal plated phase-change materials have high thermal capacity and increased thermal conductivity.
Plating on Ceramics
Do your manufacturing processes involve working with ceramics? Electroplating can add significant value to your finished products by increasing their strength and durability, enhancing corrosion resistance, promoting electrical conductivity and even improving their appearance.
One difference when plating on a ceramic substrate as opposed to typical metal-on-metal applications is the need to prepare the ceramic surface. Applying a copper or nickel base coat via electroless plating will promote adhesion of the topcoat, maximizing the results of the electroplating process.
NANO3D’s electroless (nickel and copper) plating processes for room temperature metallization (RTM) of ceramics is applicable to metallizing alumina substrates in hybrid and microcircuits, insulated heat skinks, ceramic tubes, windows and terminals. Strong bond structures are produced. Structures with hermetic seals are formed as well.
The RTM process is also useful for metallizing barium titanate and ferrites. In addition, many polymeric materials, notable polyesters, epoxies, cellulosics, mylar and acrylonitrile-butadiene-styrene may be metallized following suitable modifications of the etch.
RTM lends itself productively to the application of photolithographic technology using photo resist materials to register metallization patterns. In this manner, conductive pads may be formed for thin film and hybrid circuits. Base plates for building capacitor structures are also quite feasible.
Atomic Layer Deposition and Chemical Vapor Deposition for Semiconductor and Microfabrication Applications
ALD and CVD precursors are used for deposition of metal oxide films to form memory capacitors in semiconductor devices. Other fast growing applications are for deposition of high-k gate oxides, nitride-based barrier layers, and pure metal seed layers, plug layers, and other conductive layers. Plasma enhanced CVD and ALD processes drive increasing demand for silicon precursors, used in depositing the 32-72 layers of 3D-NAND chips and in self-aligned multiple patterning for advanced logic and memory chips. Cobalt (Co) metal is being used to encapsulate copper on-chip multi-level interconnects in the most advanced logic fabs for both foundries and IDMs. As a result, metal precursors are expected to see a compound annual growth rate (CAGR) of 6.2 percent through 2023 starting from $460 million in revenues for this year, as detailed in the latest TECHCET Critical Materials Report (CMR). The market for dielectric materials is forecasted to be $465 million this year with CAGR of 8.2 percent through 2023, as detailed in the latest CMR.