Dimethylamine Borane, DMAB

Properties

• Assay 97%
• Flash Point 43 C (lit)
• Flash Point 109.4 F (lit) 

Features and Benefits

• Strong reducing agent
• Self-catalytic oxidation on copper surface
• Qualified bath metrology for replenishment and a long shelf life

General description

Borane Dimethylamine (DMAB) is used as a reducing agent in NANO3D’s electroless Co(Ni)WBP plating process engineered for plating cobalt (nickel) patterns, barrier/seed and capping layers on wide varieties of substrates including semiconductors, ceramics, glass, polymers et al. NANO3D’s Electroless Co(Ni)WBP can be plated with sub-5 μm resolution when used in conjunction with NANO3D’s Photopatternable Catalytic Resist and NANO3D’s Electroless Cobalt (Nickel)-Tungsten-Boron-Phosphorus Plating. Electroless Co(Ni)WBP can be also plated selectively and without activation on copper lines to enhance electromigration resistance. The formulation of NANO3D’s Electroless Co(Ni)WBP Plating solution provides excellent throwing power and barrier properties to copper while improving its electromigration resistance.