$109.76 – $207.98
50 grams and 100 grams in glass bottles, meeting UN requirements, unless otherwise specified.
Borane Dimethylamine (DMAB) is used as a reducing agent in NANO3D’s electroless Co(Ni)WBP plating process engineered for plating cobalt (nickel) patterns, barrier/seed and capping layers on wide varieties of substrates including semiconductors, ceramics, glass, polymers et al. NANO3D’s Electroless Co(Ni)WBP can be plated with sub-5 μm resolution when used in conjunction with NANO3D’s Photopatternable Catalytic Resist and NANO3D’s Electroless Cobalt (Nickel)-Tungsten-Boron-Phosphorus Plating. Electroless Co(Ni)WBP can be also plated selectively and without activation on copper lines to enhance electromigration resistance. The formulation of NANO3D’s Electroless Co(Ni)WBP Plating solution provides excellent throwing power and barrier properties to copper while improving its electromigration resistance.
Dimethylamine Borane (DMAB)
|Appearance (form)||Crystals or Pellets|
|(> 0.25 m)||≤ 200 COUNTS/ML||Laser Particle Counter|
SHELF LIFE: 24 months shelf life.
PACKAGING: 50 grams and 100 grams in glass bottles, meeting UN requirements, unless otherwise specified.