Proof-of-Concept & Process Development

Is electroless plating or electroplating right for your application? Can it replace slower, more expensive or less adaptable deposition methods in your manufacturing process? Exploring new options, like unusual substrate-metal combinations? Nano3D Systems can work with you to prove a concept or establish an appropriate metallization process.
In addition to our facilities at the Advanced Technology and Manufacturing Institute (ATAMI) in Corvallis, OR, Nano3D Systems benefits from access to nearby universities and relationships with industrial partners who focus on different aspects of high-tech manufacturing.

Custom chemical formulations of plating solutions

Per customer specifications, our plating experts formulate electroless plating and electroplating solutions. We engineer electrochemical processes, plate metals & alloys films on a wide variety of substrates up to 50 cm x 50 cm and then characterize the plating films to meet the customer requirements. Contact NANO3D SYSTEMS LLC to specify your requirements and obtain a quote.

Your project, your rules.

A research and development project is a problem with many faces, with issues ranging from cost and feasibility to intellectual property issues and confidentiality. Nano3D Systems understands these concerns and can work with you to develop a project that will deliver results on your terms.


Physical and Chemical Analysis Services


Thin Films Materials Characterization Services

Physical and chemical analysis of freestanding metal foils and thin films on various substrates. Determine film purity, alloy composition, surface roughness, and thermal and mechanical properties.


Chemical Analysis Services

Analytical services to assist in method development and quality control.


Available Techniquess


  • Acid-base
  • Redox
  • Precipitation
  • Complexometric


  • UV-VIS
  • FT-IR
  • Secondary Ion Mass (SIMS)
  • Energy Dispersive X-Ray (EDX)

Surface characterization

  • Profilometry
  • Optical microscopy
  • Scanning electron microscopy (with or without EDX)
  • Atomic force microscopy

Physical Analysis

  • Internal stress
  • Film-substrate adhesion
  • Differential Scanning Calorimetry (DSC)
  • Linear thermal expansion & thermal conductivity

Chemical Analysis

  • Voltammetry/CVS

ALD & CVD precursor synthesis and characterization with NANO3D’s Partner 

  • Chemical Synthesis and Purification Equipment

–Shlenk techniques

–Glove Boxes


  • Chemical Analysis

–NMR, UV spectroscopy

–Vibrational spectroscopy: IR- and Raman spectroscopy of the powders, single crystals, solutions; spectra of isotopic substituted complexes (M, O, H), polarized spectra, calculations


–X-ray single crystal analysis

  • Volatility measurements 

–Static method with membrane zero-manometer (1 – 760 Torr)

–Flow method (10-3 – 1 Torr)

–Knudsen’s method with mass-spectrometric indication (10-6 – 10-2 Torr)

–MCV (new method of calibrated volume) (10-6 – 10 Torr)

  • Thermostability

–TGA (thermogravimetrical analysis)

–DTA (differential thermal analysis)

  • Vapor deposition tools and surface reaction study

–ALD and CVD deposition equipment

–In-situ high temperature mass-spectroscopy

  • Thin Film Analysis

–Scanning and transmission electron microscopy

–X-ray diffraction

–X-ray photoelectron spectroscopy

–Mass-spectrometry with layer-to-layer spraying of sample surface by laser emission