High-Speed Bright Copper Electroplating Solution

$29.60$398.25

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SKU: EP-EC1-65L-01-SEMI Category: .

Product Details

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Description

Packaging

1 liter poly bottle, 1 gallon or 5 gallon pail, meeting UN requirements, unless otherwise specified.

Quality and Deposits Characteristics

  • Density of 8.9 g/cm3
  • Electrical resistivity of 1.7 – 1.8 µΩ cm
  • High in-film purity (<10 ppm for N, S, C, Cl)
  • Low surface roughness, RMS < 10 nm @ 1 µm thick Cu
  • Planarization of trenches (no recess in 1 µm wide x 0.5 µm deep trenches with 0.8 µm thick Cu)
  • Strong (111) texture with small (220) and (200)
  • Reflectivity > 75%
  • Elongation of 19 – 32%

Features and Benefits

  • The use of single electroplating solution containing plating additives
  • Stable additives with large process window
  • High purity electrolyte and long shelf life
  • High cloud point (> 80 OC) and low foaming
  • Low surface tension plating bath (~44 dyne/cm @ 25 OC)
  • High speed plating (>3 µm/min)
  • Uniform and flat bumps, pads, patterns and redistributions layers
  • Void free filling of vias and trenches

General description

High Speed Bright Copper Electroplating Solutionis an electrolytic acid copper process engineered for platingcopper bumps, pads, patterns and redistribution layers as well as filling vias and trenches on wide varieties of substrates including semiconductors, glass, polymers et al. NANO3D’s High Speed Copper Electroplating process operates in wide range of current densities and provides excellent throwing power, improved levelling characteristics, and ductile low stress deposits. NANO3D copper electroplating processes produces bright copper deposits and smooth surface. NANO3D’s copper electroplating solution is made up of cupric sulphate and sulphuric acid with small additions of hydrochloric acid and organic additives. NANO3D’s organic additives have wide concentration process window eliminating the need in separate additive solutions and replenishment for about 120 Amp-hours of electroplating.

Safety & Documentation

Safety Information

Download Safety Data Sheet. Contact NANO3D SYSTEMS LLC for Certificate of Analysis.


SPECIFICATION (Rev. 1 160429)

EP-EC1-65L-01-SEMI  

High Speed Bright Copper Electroplating Solution – Semiconductor Grade

 

COMPOSITION:              

 

SPECIFICATION

TEST method

      ASSAY

 

 

                H2SO4

8.0 ± 0.4 g/L

Titration

 

 

 

                Cu

65.0 ± 2 g/L

Titration

 

 

 

                Chloride

 

             Organic Additives

40 ± 4 mg/L

 

600 ± 60 mg/L

 

Titration

 

HPLC

 

 

 

     METALS

 

 

 

 

 

                As   (Arsenic)

               Bi    (Bismuth)

               Ca   (Calcium)

≤  0.2 ppm

≤  0.2 ppm

≤  0.3 ppm

ICPMS

ICPMS

ICPMS

               Cr    (Chromium)

               Fe    (Iron)

≤ 0.2 ppm

≤ 0.6 ppm

ICPMS

ICPMS

               Pb    (Lead)

               Mn   (Manganese)

               Ni     (Nickel)

≤ 0.1 ppm

≤ 0.1 ppm

≤ 0.3 ppm

ICPMS

ICPMS

ICPMS

                 K      (Potassium)

≤ 2 ppm

ICPMS

                 Se     (Selenium)

≤ 0.2 ppm

ICPMS

                 Na    (Sodium)

               Te    (Tellurium)

               Sn    (Tin)

               Zn    (Zinc)

 

≤ 5 ppm

≤ 0.2 ppm

≤ 0.2 ppm

≤ 0.2 ppm

 

ICPMS

ICPMS

ICPMS

ICPMS

 

 

 

 

 

 

SHELF LIFE:       24 months

 

PACKAGING:        1 liter poly bottle, 1 gallon or 5 gallon pail, meeting UN requirements, unless otherwise specified.

Additional Info

Formulation of NANO3D’s High Speed Bright Copper Electroplating Solution*Range:Optimum:
Cu60 – 70 g/l65 g/l
H2SO46 – 10 g/l8 g/l
Chloride30 – 50 ppm40 ppm
Plating Additives300 – 900 ppm600 ppm
Temperature18 – 25°C22°C
Anode to cathode ratio2:1 to 3:12:1
Cathode Current Density10 to 25 mA/cm2 (up to 400mA/cm2)
Deposition Rate~0.15 – 0.37 µm/min @ 10 – 25 mA/cm2 (~5 µm/min @ 400 mA/cm2)

 

*NANO3D’s High Speed Bright Copper Electroplating Solution is manufactured by adding the proper amounts of sulphuric acid, hydrochloric acid and plating additives to copper sulphate solution. The concentrations of inorganic components and metal trace impurities are reported on CofA’s for copper sulphate solution and high speed bright copper electroplating solution. To analyse and control the plating additives, please, contact NANO3D SYSTEMS LLC.