Conformal Nickel Barrier Electroless Plating Solution

Packaging

1 liter and 1 gallon poly bottles, meeting UN requirements, unless otherwise specified.

Quality and Deposits Characteristics

• Conformality up to 95%
• Corrosion resistant
• Amorphous NiWP barrier crystallization temperature > 350 oC
• No interdiffusion in NiWP/Cu layers at 350 oC for 60 min
• NiW(>2%)P(>12%)
• Roughness of 0.9 nm to 4.2 nm for 45 nm to 95 nm NiWP films
• Thickness non-uniformity (RSD) < 2%
• Thickness continuity < 10 nm
• Adhesion to dielectric substrates > 65 MPa

Features and Benefits

• Conformal electroless NiWP films
• High throwing power
• Selective plating
• Surfaces are uniform and smooth with well-controlled thickness and excellent uniformity
• Diffusion barrier
• Adhesion layer
• Plateable barrier
• Qualified bath metrology to replenish and maintain electroless NiWP plating bath

General description

Electroless Nickel Tungsten Phosphorus Plating is an electroless nickel process engineered for platingnickel patterns and redistribution layers as well as filling vias and trenches on wide varieties of substrates including semiconductors, glass, polymers et al. NANO3D’s Electroless Nickel Tungsten Phosphorus Plating process can be plated onto sub-5 μm features when used in conjunction with NANO3D’s Photopatternable Catalytic Resist. The blend of elements in NANO3D’s Electroless Nickel Tungsten Phosphorus Plating solution prevents crystallization, provides a diffusion barrier & adhesion layers between substrates and other metals.