Conformal Nickel Barrier Electroless Plating Solution

$64.17$178.21

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SKU: ELP-EL5-515A-01 Category: .

Product Details

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Description

Packaging

1 liter and 1 gallon poly bottles, meeting UN requirements, unless otherwise specified.

Quality and Deposits Characteristics

  • Conformality up to 95%
  • Corrosion resistant
  • Amorphous NiWP barrier crystallization temperature > 350 oC
  • No interdiffusion in NiWP/Cu layers at 350 oC for 60 min
  • NiW(>2%)P(>12%)
  • Roughness of 0.9 nm to 4.2 nm for 45 nm to 95 nm NiWP films
  • Thickness non-uniformity (RSD) < 2%
  • Thickness continuity < 10 nm
  • Adhesion to dielectric substrates > 65 MPa

Features and Benefits

  • Conformal electroless NiWP films
  • High throwing power
  • Selective plating
  • Surfaces are uniform and smooth with well-controlled thickness and excellent uniformity
  • Diffusion barrier
  • Adhesion layer
  • Plateable barrier
  • Qualified bath metrology to replenish and maintain electroless NiWP plating bath

General description

Electroless Nickel Tungsten Phosphorus Plating is an electroless nickel process engineered for platingnickel patterns and redistribution layers as well as filling vias and trenches on wide varieties of substrates including semiconductors, glass, polymers et al. NANO3D’s Electroless Nickel Tungsten Phosphorus Plating process can be plated onto sub-5 μm features when used in conjunction with NANO3D’s Photopatternable Catalytic Resist. The blend of elements in NANO3D’s Electroless Nickel Tungsten Phosphorus Plating solution prevents crystallization, provides a diffusion barrier & adhesion layers between substrates and other metals.

 
 

Safety & Documentation

Safety Information

Download Safety Data Sheet . Contact NANO3D SYSTEMS LLC for Certificate of Analysis.


SPECIFICATION (Rev. 1 090309)

ELP-EL5-515A-01
Stock Solution EL5 for Electroless NiW Plating
COMPOSITION:

ASSAYSPECIFICATIONTEST METHOD
Nickel Sulfate Hexahydrate25 ± 2.5 g/LSpectrophotometry
Sodium Citrate85 ± 8.5 g/LTitration
Sodium Tungstate Dihydrate35 ± 3.5 g/LTitration
Wetting Agent0.1 ± 0.01 g/LHPLC
pH9 ± 0.1 @ 23 ± 1ºCpH meter

Metals

Al (Aluminum)

 

 < 10 ppm

 

ICPMS

 

 

 

 

As (Arsenic)

 

< 10 ppm

 

ICPMS

 

 

 

Au (gold)

< 10 ppm

ICPMS

 

 

 

Ca (Calcium)

< 10 ppm

ICPMS

 

 

 

Cd (Cadmium)

< 10 ppm

ICPMS

 

 

 

 

 

 

 

 

 

Cr (Chromium)

< 10 ppm

ICPMS

 

 

 

Fe (Iron)

<10 ppm

ICPMS

 

 

 

In (indium)

< 10 ppm

ICPMS

 

 

 

Mg (Magnesium)

< 10 ppm

ICPMS

 

 

 

Mn (Manganese)

< 10 ppm

ICPMS

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Pb (Lead)

< 10 ppm

ICPMS

 

 

 

Sn (Tin)

< 10 ppm

ICPMS

 

 

 

Tl (Thallium)

< 10 ppm

ICPMS

 

 

 

Zn (Zinc)

< 10 ppm

ICPMS

 

 

 

Particles                    
(> 0.25 mm)

 

≤ 200 counts/ml

 

Laser Particle Counter

 

 

SHELF LIFE: This solution has 12 months shelf life.

PACKAGING: 1 liter and 1 gallon poly bottles, meeting UN requirements, unless otherwise specified.

Additional Info

OPERATING CONDITIONS

Formulation of NANO3D’s Electroless NIWP plating solutionW/W (%)
Electroless NIW plating Stock Solution> 98 %
Sodium Hypophosphite10 – 20 g/l
Temperature55 °C – 80 °C
pH8.5 – 9.3