NANO3D SYSTEMS, LLC has successfully completed NSF SBIR Phase II/IIB project. Project Outcomes Report for award # 1456385 is available in To expand commercialization efforts of NSF SBIR related products such as plating solutions for High Speed (> 4 µm/min) Copper Deposition and Controlled-Expansion (CTE < 2 ppm) Nickel-Iron Alloy Interconnects et al. We have established marketing, distribution and sales in China through our distributors (Phentex Fine Chemicals and eChem360 with contact info at

NANO3D SYSTEMS, LLC also expands its product portfolio to Copper, Copper-Nickel, Stainless-Steel and Silver conductive fabrics with low surface resistance of < 0.05 Ohm/Sq and high shielding effectiveness having attenuation of >60 dB in 10 MHz to > 3 GHz frequency range. The coating processes, used to deposit metals in our fabrics (nylon, polyester, cotton and non-woven et al), deliver an impervious bond that can not be broken. The resulting bond delivers unparalleled durability even under conditions that require constant flexing, bending, stretching or abrading. No other metallized fabric is more durable and because of superior bonding technology, our conductive fabrics deliver proven, consistent and reliable electrical conductivity and electromagnetic reflectivity performance, even in the most challenging environments. The electrosmog or the electromagnetic (EM) radiation is considered as a major environmental pollutant and has been under debate for quite some time. For more information and to purchase our Conductive Fabrics Blocking EMF/RFID/EMI/RF Radiation visit our online store at and

Industry Trends

Advanced Packaging and Scaling

The shift to 5G wireless networks is driving a need for new IC packages and modules in smartphones and other systems. 5G devices will require an assortment of new technologies, such as phased-array antennas and antenna-in-package.

The path to 5nm is well-defined compared with 3nm. 5nm is still a finFET. We are entering a transition period from finFETs to other device architectures, such as nanosheet et al at N3. To extend the finFET to N3, we need a special technique to enhance the single fin power and/or reduce backend parasitics.

Wearables and Conductive Fabrics

Wearable electronics are emerging as a platform for next-generation, human-friendly, electronic devices. A new class of devices with various functionality and amenability for the human body is essential. These new conceptual devices are likely to be a set of various functional devices such as displays, sensors, batteries, etc., which have quite different working conditions, on or in the human body.

Conductive fabrics are an essential part of wearable electronics and devices. Metallization of fabrics is being driven by several applications that include but not limited to 1) smart fabrics and wearable technology, 2) military, 3) EMI/RFI shielding, 4) decorative, 5) cosmetics and glamour, 6) antibacterial and antimicrobial, 7) medical sensors such as sweating, monitoring heart rate, breathing etc., and 8) automotive, to name a few. Conductive textiles market is projected to reach $4.29 billion by 2025 with CAGR of 16.4% (Market Research Report from Grand View Research). Rising awareness about the high-tech wearables that can enable health monitoring, track the surrounding environment and provide protection from hazardous pollutants in the environment are the factors propelling market growth.