Cobalt-Tungsten-Boron-Phosphorous Electroless Plating Solution

$68.77$199.43

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SKU: ELP-EL3W-100B-01 Category: .

Product Details

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Description

Packaging

1 liter or 1 gallon poly bottles, meeting UN requirements, unless otherwise specified.

Quality and Deposits Characteristics

  • Conformality up to 95%
  • Corrosion resistant
  • Amorphous CoWBP barrier crystallization temperature > 350 oC
  • No interdiffusion in CoWBP/Cu layers at 350 oC for 60 min
  • CoW(>2%)B(>4%)P(>12%)
  • Roughness of <15 nm for ~200 nm CoWBP films
  • Thickness continuity < 10 nm
  • Adhesion to dielectric substrates and metals > 65 MPa

Features and Benefits

  • Alkali metals (Na, K) – free plating solution
  • Activation-free plating on copper and other metals
  • Conformal electroless CoWBP films
  • High throwing power
  • Selective plating
  • Surfaces are uniform and smooth with well-controlled thickness and excellent uniformity
  • EM capping layer for copper metallization
  • Diffusion barrier for copper and oxygen
  • Adhesion layer
  • Plateable barrier

General description

Electroless Cobalt-Tungsten-Boron-Phosphorus Platingis is an electroless cobalt process engineered for plating CoWBP selectively on copper lines to improve the electromigration resistance as well as filling vias and trenches on wide varieties of substrates including semiconductors, glass, polymers et al. NANO3D’s Electroless Cobalt-Tungsten-Boron-Phosphorus Plating process can be selectively plated onto sub-20 nm copper lines as well as sub-5 μm features when used in conjunction with NANO3D’s Photopatternable Catalytic Resist. The blend of elements in NANO3D’s Electroless Cobalt-Tungsten-Boron-Phosphorus Plating solution prevents crystallization, provides a diffusion barrier & adhesion layer between substrates and other metals.

 
 

Safety & Documentation

Safety Information

Download Safety Data Sheet . Contact NANO3D SYSTEMS LLC for Certificate of Analysis.


SPECIFICATION (Rev. 1 090307)

ELN-EL3W-100B -01
Stock Solution EL3W for Electroless CoWBP Plating


COMPOSITION:

ASSAYSPECIFICATIONTEST METHOD
Cobalt Sulfate Heptahydrate20 ± 2.0 g/LSpectrophotometry
Boric Acid30 ± 3 g/LTitration
Citric Acid Monohydrate100 ± 10 g/LTitration
Tungstic Acid10 ± 1.0 g/LTitration
Wetting Agent0.25 ± 0.02 g/LHPLC
pH9 ± 0.1 @ 23 ± 1ºCpH meter

Metals

Al (Aluminum)

 

 
< 10 ppm

 

ICPMS

 

 

 

As (Arsenic)

< 10 ppm

ICPMS

 

 

 

Au (gold)

< 10 ppm

ICPMS

 

 

 

Ca (Calcium)

< 10 ppm

ICPMS

 

 

 

Cd (Cadmium)

< 10 ppm

ICPMS

 

 

 

Co (Cobalt)

< 10 ppm

ICPMS

 

 

 

   

 

 

 

Fe (Iron)

<10 ppm

ICPMS

 

 

 

In (indium)

< 10 ppm

ICPMS

 

 

 

Mg (Magnesium)

< 10 ppm

ICPMS

 

 

 

Mn (Manganese)

< 10 ppm

ICPMS

 

 

 

      
   

 

 

 

Ni (Nickel)

< 10 ppm

ICPMS

 

 

 

Pb (Lead)

< 10 ppm

ICPMS

 

 

 

Sn (Tin)

< 10 ppm

ICPMS

 

 

 

Tl (Thallium)

< 10 ppm

ICPMS

 

 

 

Zn (Zinc)

< 10 ppm

ICPMS

 

 

 

Particles                    
(> 0.25 mm)

 

≤ 200 counts/ml

 

Laser Particle Counter

 

 

SHELF LIFE: This solution has 12 months shelf life.

PACKAGING: 1 liter and 1 gallon poly bottles, meeting UN requirements, unless otherwise specified.

Additional Info

OPERATING CONDITIONS

Formulation of NANO3D’s Electroless CoWBP plating solutionW/W (%)
Electroless CoW plating Stock Solution> 98 %
Reducing Agents (hypophosphite and DMAB)< 2 %
Temperature55 °C – 80 °C
pH8.5 – 9.3