Low-Stress INVAR Electroplating Solution

Packaging

1 liter poly bottle, 1 gallon or 5 gallon pail, meeting UN requirements, unless otherwise specified.

Quality and Deposits Characteristics

• Density of 8.1 g/cm3
• Composition (Wt. %) of 64%Fe, 36%Ni
• Linear Thermal Expansion (10-6, K-1) of 0.4±0.1
• Specific Heat Capacity (J/gK) at 573 K of 0.45 ±0.05
• Thermal Conductivity (W/mK) of 43 ± 5
• Internal stress (MPa) of 30 ± 2
• Tensile Stress (MPa) of 500 ± 60
• Yield Strength (MPa) of 280 ± 50
• Ductility (%) of 40 ± 10

Features and Benefits

• Deposits have low internal stress and are very ductile
• Near-zero linear thermal expansion in plated alloy films
• Surfaces are uniform and smooth with well-controlled thickness and excellent uniformity
• Qualified bath metrology for replenishment and a long shelf life

General description

INVAR Electroplating Chemicals and processes are designed for the fabrication of low stress, pinhole-free nickel-iron alloy films with extremely low coefficients of thermal expansion.