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The Third Prize at the Innovation and Entrepreneurship Competition

Val Dubin, founder and president of NANO3D SYSTEMS LLC, was awarded the third prize at the Innovation and Entrepreneurship Competition. The weeklong competition took place November 2019 in Hangzhou, Zhejiang province in China. There were a record number of entries for this prestigious competition with over 1600 applicants from various companies around the world, which has doubled from the previous year. Participants were required to have innovative technologies with strong market potential. Winning projects that successfully launch in Hangzhou within one year of the competition will be granted a maximum subsidy of 5 million yuan (over $711,000). They will also enjoy preferential taxes, subsidized housing, matching of funding and loan policies etc. Val Dubin presented, at the competition in Hangzhou, the project titled: “Atomic Layer & Electrochemical Deposition for 2.5D/3D Interconnects and Fine-Pitch Bumping”.

 

The participants of the competition were engaged in communication with various Innovation and entrepreneurial resources in Hangzhou and other cities in Zhejiang province. Those resources include venture capitalists, well-known enterprises, research institutions and various science & industrial parks. Hangzhou is a paradise-like city with a modern infrastructure, famous for its historical relics, natural scenery, the headquarters of the e-commerce giant Alibaba, and the venue of the 2016 G20 Summit. In order to meet the needs of Hangzhou’s rapid economic development, attract innovative talents and entrepreneurial projects, Hangzhou has established a number of high-tech parks, including international science parks for non-Chinese. To promote the development of high-tech industries, China is also implementing increasingly strict intellectual property protection laws and support for high-tech companies.

 

“We are very honored to have been awarded 3rd prize at the Grand Final of the Competition. The respective honor came despite stiff competition from companies around the world and we’re proud to have such prestigious distinction. Hangzhou science parks are the ideal place to establish NANO3D’s presence in China, scale up our electrochemical technology, plating materials as well as develop new products with atomic level control such as atomic layer deposition. NANO3D’s high density interconnect (HDI) technology enables higher scalability & density, controlled-expansion, low cost of 2.5D/3D interconnects and fine-pitch bumping in advanced chip packaging applications. China has dominant market share in consumption of HDI plating chemicals of over $2B per year and we are excited to service this market with NANO3D’s innovative technology & products”, said Val Dubin.

The Innovation & Entrepreneurship Competition for International Talents 2019 in Hangzhou, China

NANO3D SYSTEMS is pleased to be nominated as a semifinal competitor of The Innovation & Entrepreneurship Competition for International Talents 2019 in Hangzhou, China. We see this nomination as an opportunity for our eLOCOS(TM) plating technology to expand into the Chinese market and establish NANO3D’s presence in China. eLOCOS(TM) technology enables small form factor, affordable, reliable 2.5D/3D microsystems and fine-pitch bumps. It overcomes the key technical roadblocks in manufacturing of fine-pitch, large area, multi-layer, flexible printed circuit boards and high density interconnects for 2.5D interposers, 3D IC, power electronics et al.

As per the findings of a business intelligence report published by IndustryARC, Asia-Pacific occupied a dominating regional share of 40% in the global electroplating market. It was valued at $15B in 2018 and it is estimated to grow with a healthy compound annual growth rate (CAGR) of 4% during the forecast period 2019-2025. Through 2024, electronics will remain the largest end-use market, followed by the automotive sector. China accounts for 21% of advanced chip packaging revenue (~$30B) in Y2018 (Taiwan 52%, US – 15%). China is the #1 manufacturer of smart phones with ~38.8% market share. China is also the #1 manufacturer of automotive’s with ~28 millions annual car sales.

The semifinal competition and grand finals will be held in Hangzhou in November 2019. Hangzhou International Human Resources Exchanges and Cooperation Conference will be held concurrently. Through visits and match-making meetings, the teams have excellent opportunity to personally learn  about Hangzhou, witness the mix of nature beauty and modernization of Hangzhou, and see the ecosystem of various high-tech industry parks. Furthermore through this event, teams make friends all over the world and find potential business partners. In many instances, no matter whether winning the final or not, every team is a winner in this event! HERE is a video presentation for the 2018 Competition.

 

NANO3D SYSTEMS NEWS – Q3 2019

NANO3D SYSTEMS, LLC has successfully completed NSF SBIR Phase II/IIB project. Project Outcomes Report for award # 1456385 is available in Research.gov. To expand commercialization efforts of NSF SBIR related products such as plating solutions for High Speed (> 4 µm/min) Copper Deposition and Controlled-Expansion (CTE < 2 ppm) Nickel-Iron Alloy Interconnects et al. We have established marketing, distribution and sales in China through our distributors (Phentex Fine Chemicals and eChem360 with contact info at https://nano3dsystems.com/contact/).

NANO3D SYSTEMS, LLC also expands its product portfolio to Copper, Copper-Nickel, Stainless-Steel and Silver conductive fabrics with low surface resistance of < 0.05 Ohm/Sq and high shielding effectiveness having attenuation of >60 dB in 10 MHz to > 3 GHz frequency range. The coating processes, used to deposit metals in our fabrics (nylon, polyester, cotton and non-woven et al), deliver an impervious bond that can not be broken. The resulting bond delivers unparalleled durability even under conditions that require constant flexing, bending, stretching or abrading. No other metallized fabric is more durable and because of superior bonding technology, our conductive fabrics deliver proven, consistent and reliable electrical conductivity and electromagnetic reflectivity performance, even in the most challenging environments. The electrosmog or the electromagnetic (EM) radiation is considered as a major environmental pollutant and has been under debate for quite some time. For more information and to purchase our Conductive Fabrics Blocking EMF/RFID/EMI/RF Radiation visit our online store at https://nano3dsystems.com/product-category/conductive-fabrics/ and https://www.amazon.com.

Industry Trends

Advanced Packaging and Scaling

The shift to 5G wireless networks is driving a need for new IC packages and modules in smartphones and other systems. 5G devices will require an assortment of new technologies, such as phased-array antennas and antenna-in-package.

The path to 5nm is well-defined compared with 3nm. 5nm is still a finFET. We are entering a transition period from finFETs to other device architectures, such as nanosheet et al at N3. To extend the finFET to N3, we need a special technique to enhance the single fin power and/or reduce backend parasitics.

Wearables and Conductive Fabrics

Wearable electronics are emerging as a platform for next-generation, human-friendly, electronic devices. A new class of devices with various functionality and amenability for the human body is essential. These new conceptual devices are likely to be a set of various functional devices such as displays, sensors, batteries, etc., which have quite different working conditions, on or in the human body.

Conductive fabrics are an essential part of wearable electronics and devices. Metallization of fabrics is being driven by several applications that include but not limited to 1) smart fabrics and wearable technology, 2) military, 3) EMI/RFI shielding, 4) decorative, 5) cosmetics and glamour, 6) antibacterial and antimicrobial, 7) medical sensors such as sweating, monitoring heart rate, breathing etc., and 8) automotive, to name a few. Conductive textiles market is projected to reach $4.29 billion by 2025 with CAGR of 16.4% (Market Research Report from Grand View Research). Rising awareness about the high-tech wearables that can enable health monitoring, track the surrounding environment and provide protection from hazardous pollutants in the environment are the factors propelling market growth.

METALLIZED CONDUCTIVE FABRICS

NANO3D SYSTEMS, LLC expands its product portfolio to Copper, Copper-Nickel, Stainless-Steel and Silver conductive fabrics with low surface resistance of < 0.05 Ohm/Sq and high shielding effectiveness having attenuation of >60 dB in 10 MHz to > 3 GHz frequency range. Unlike ordinary metallized fabrics, the coating processes, used to deposit metals in our fabrics (nylon, polyester, cotton and non-woven et al), deliver an impervious bond that can’t be broken. The resulting bond delivers unparalleled durability even under conditions that require constant flexing, bending, stretching or abrading. No other metallized fabric is more durable and because of superior bonding technology, our conductive fabrics deliver proven, consistent and reliable electrical conductivity and electromagnetic reflectivity performance even in the most challenging environments.

Metallization of fabrics is being driven by several applications that include but not limited to 1) smart fabrics and wearable technology, 2) military, 3) EMI/RFI shielding, 4) decorative, 5) cosmetics and glamour, 6) antibacterial and antimicrobial, 7) medical sensors such as sweating, monitoring heart rate, breathing etc., and 8) automotive, to name a few. Conductive textiles market is projected to reach $4.29 billion by 2025 with CAGR of 16.4% (Market Research Report from Grand View Research). Rising awareness about the high-tech wearables that can protect the wearer, enable health monitoring, track the surrounding environment and provide protection from hazardous pollutants in the environment are the factors propelling market growth.

NANO3D’s conductive fabrics protect from radiation/HF Signal/WiFi, preserve the working integrity of electronic devices in the event of EMP or CME, blocking RF signals such as cell, Bluetooth, WiFi, and GPS. As an insert in the wallet or handbag, metallized fabrics protect credit cards from data theft. Conductive fabrics also preserve the working integrity of electronic devices in the event of EMP or CME. NANO3D’s conductive fabrics can be used for garments, drapes, bedding, curtains, tents, etc. as well as an effective shielding for cell towers, microwave signals, phones, smart meters, security systems, radar, military broadcast and more. Our metallized conductive fabrics can be also used to make anti-static and antibacterial clothes, wireless meter shielding and shielding curtains, E-textiles and smart fabrics, EMP and EMI radiation reduction, and more.

Our metallized conductive fabrics are provided in collaboration with NANO3D’s partner. Visit NANO3D’s online store at https://nano3dsystems.com/product-category/conductive-fabrics/ for more information.

NANO3D SYSTEMS NEWS – Q2 2019

NANO3D SYSTEMS, LLC (NANO3D) formulates, markets and sells specialty chemicals for metal deposition including Electroplating (EP), Electroless Plating (ELP), Atomic Layer Deposition (ALD) and Chemical Vapor Deposition (CVD). Our products are used for research and development as well as commercial scale applications, especially in microelectronic, transportation and chemical industries. We also provide custom formulations of plating solutions, precursor synthesis, micro-fabrication and characterization services.

NANO3D launched the new webpage – Product Resources containing an interactive periodic table with information on properties, electrochemical deposition solutions and applications for 83 elements as well as information on electroplating and electroless plating processes. 38 metals & compounds can be deposited using electrochemical products available online at our STORE (EP Au, Cu, Cr, Ni, NiFe, NiCo, Pd, Sn, ELP AgW, Au, Cu, Sn, Zn, CuZn, CoWP, NiP, NiWP, CoWBP as well as plateable TiOx/Pd photoresist, EL Ni kits, Cu plated graphite & Si particles, CNT solutions, Ni & NiFe & Pd foils, reducing agents, plating additives et al). There are 10 metals including Ir, Pd, Pt, Ru, Rh, Au, Ag, Co, Ni, Cu that can be deposited using ALD & CVD precursors supplied by NANO3D in collaboration with our partner.

INDUSTRY TRENDS

Advanced Packaging and Scaling

The electrochemical deposition (ECD) equipment and materials market for advanced IC packaging is heating up as 2.5D (silicon, organic and glass interposers), 3D (through-silicon vias, TSV) and fan-out (wafer-level and panel-level processes) technologies begin to ramp up. Heterogeneous multi-chip packaging and fan-out packaging processes enable semiconductor companies to achieve performance goals without just shrinking feature sizes.

Plating for advanced packaging includes Cu & SnAg & Ni pillars with down to 10-30 µm pitch and Cu redistribution layers (RDL) for flip chip technology as well as through-substrate via (hole) filling and Cu RDL’s for 2.5D interposers and 3D-ICs.

Plated mega-Cu pillars (~200 µm thick) and Cu RDL are used for fan-out packages. The latest high-density fan-out packages are migrating toward the 1 µm line/space and beyond. Redistribution layers with smaller critical dimensions enable reducing the total number of redistribution process levels in a fan-out package. At these critical dimensions (CDs), fan-outs will provide better performance and cost. Thickness uniformity, high plating speed with current densities in the range of 400 – 600 mA/cm2, and low stress of Cu electrodeposits are very important for advanced packaging.

Scaling continues to be a vibrant part of the IC business. TSMC is reporting that 25% of their revenue is coming from 7 nm, and 5 nm risk wafers with EUVL up to 14 layers and interconnect pitch of below 30 nm are starting this year or early next year. It’s unclear if copper can extend to 3nm, so the industry is exploring other metals such as cobalt et al. Intel moved from traditional Cu to Co materials for two of the interconnect layers at 10 nm. W plugs at contact level are being replaced with Co fill process.

Defect-free filling of sub-15 nm damascene features (trenches and vias), low electrical resistivity and high electromigration resistance are very important for scaling of on-chip interconnects.

Atomic Layer Deposition and Chemical Vapor Deposition

NANO3D SYSTEMS, LLC expand its product portfolio to ALD & CVD metal-organic precursors for deposition of Iridium (Ir), Palladium (Pd), Platinum (Pt), Ruthenium (Ru), Rhodium (Rh), Gold (Au), Silver (Ag), Cobalt (Co), Nickel (Ni) and Copper (Cu) conformal films and nano-layers. The specialty chemicals, metal-organic precursors, are provided in collaboration with NANO3D’s partner.

NANO3D SYSTEMS NEWS – Q1 2019

NANO3D SYSTEMS LLC is in final phase of SBIR Phase II/IIB project founded by National Science Foundation. NANO3D’s eLOCOSTM plating technology has been endorsed by 22 customers including world largest companies in semiconductor, transportation and consumer electronics industries. NANO3D has also recently launched our new website (https://nano3dsystems.com) in collaboration with DirectHitsWebMarketing.com and Transene Company Inc. to market and sell products in the following categories:

  1. Electroless Plating Solutions (low resistivity Cu, ohmic contact NiP, conformal NiWP and CoWP barriers,  cyanide-free immersion Au, Immersion Zn and electroless Sn)
  2. Electroplating Solutions (high speed & bright Cu, low stress Ni, low stress & low CTE Invar, low stress Permalloy, low stress NiCo, cyanide-free Au, nano-crystalline Pd)
  3. Electrochemical microfabrication (plateable TiOx-Pd photoresist, Electroless NiP and Cu on Ceramics, Cu plated graphite particles, Ultra-Thin Ni & NiFe alloys Foils)

INDUSTRY TRENDS

Plating for Electronics Applications

The focus issues of JECS highlights Advances in Electrochemical Processes for Interconnect Fabrication in Integrated Circuits, Vol. 166, No. 1, 2019. Contribution from leading researches cover fundamental and applied aspects of electrochemical nano- and micro-fabrication including but not limited to:

  1. Superconformal cobalt plating for contacts and local interconnects in 10 nm and beyond technology that improves via resistance and electromigration. 
  2. Superconformal copper plating of through-silicon vias (TSV) and through-glass vias (TGV) interconnects for MEMS devices and glass interposers.
  3. Superconformal gold plating of recessed surface features for compound semiconductors and related optoelectronics to enable dense 3-D interconnects.
  4. Electroplating of copper for damascene interconnects, copper on ruthenium liner for electronics interconnects, gold & nickel for MEMS and FeCo & FeCoMn for magnetic recording.
  5. Electroless copper seed conformal plating for TSV interconnects and FeNiB alloy with low coefficient of thermal expansion for high-density packaging.

Superconformal cobalt and copper plating have been achieved in a single suppressor-type additive plating bath, while superconformal gold plating was demonstrated in an accelerating-type additive chemistry that is a significant departure from the conventional damascene process that uses three additives (accelerator, suppressor and leveler). The bottom-up fill mechanisms are based on pH & suppressor gradient for Co deposition, suppressor reduction for Cu TGV plating, S-shaped Negative Differential Resistance and Curvature Enhanced Accelerator Coverage models for superconformal plating of different metals. These mechanisms were discussed in papers from companies & research institutions including  Atotech, Corning, LAM Research, NIST, ITRI, Sandia National Labs and various universities such as Binghamton University SUNY, National Tsing Hua University et al.

NANO3D SYSTEMS is pleased to be nominated to the 2017 World Materials Forum Start Up Challenge.

NANO3D SYSTEMS is pleased to be nominated to the 2017 World Materials Forum Start Up Challenge. We see this nomination as an opportunity for our eLOCOS(TM) plating technology to be part of WMF’s mission to achieve the objective of materials efficiency for better growth with materials/IOT industry leaders throughout the world. World Materials Forum (WMF) was held on June 29 – 30th in Nancy, France. This year forum includes about 260 invited C–suite participants in materials / IOT companies throughout the world. It’s different than conventional industry forums – only thought leaders and company executives across industries driving new technologies for sustainability. This leads to a fascinating network and information flow.

WMF asked Nano3D Systems’ president Val Dubin to describe Nano3D’s breakthrough technology and its contribution to the WMF Overall Objective of “Material Efficiency for Better Growth.” Dr. Dubin’s response was:

“NANO3D provides revolutionary eLOCOS metallization technology for advanced 3D devices. NANO3D addresses $15.3B metal plating market opportunity that needs advanced plating technology to decrease the interconnect feature sizes and increase the power density for next generation consumer and power electronic devices.

NANO3D’s patented eLOCOS plating technology is based on novel materials and enables: a) drastically increase the interconnect density by selectively plating ultra-small features of high aspect ratios to reduce the form factor, and b) fabricate controlled expansion interconnects by plating alloys with unique properties to eliminate CTE mismatch between buildup materials.

We partner with major plating tool suppliers and R&D consortiums to qualify NANO3D’s process technology and plating chemicals, and then scale up the production of materials through toll manufacturing and licensing to established chemical companies.

NANO3D additive metallization technology drastically reduces the usage of copper and polishing slurry to fabricate multichip interconnects to enable small form factor, affordable and reliable 3D microsystems. “