Silver-Tungsten Electroless Plating Solution

$104.62$403.81

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SKU: ELP-EL4AW-30A-01 Category: .

Product Details

Description

Packaging

1 liter poly bottle or 5 liter poly Jerrican, meeting UN requirements, unless otherwise specified.

Features and Benefits

  • Low resistivity AgW
  • Low temperature deposition process (18-40 oC)
  • Conformal electroless AgW films
  • High throwing power
  • Selective plating
  • Surfaces are uniform and smooth with well-controlled thickness and excellent uniformity

Quality and Deposits Characteristics

  • AgW films with ~2.1 at.% of W
  • Resistivity of ~4 µOhm cm
  • Grain Size of <50 nm
  • Corrosion stability in air up to 250 oC
  • No interdiffusion in Si substrate after 470 oC anneal
  • Adhesion to dielectric substrates > 65 MPa

General Description

Silver-tungsten (AgW) electroless plating is an electroless AgW process engineered for plating AgW lines, patterns and redistribution layers as well as filling vias and trenches on wide varieties of substrates including semiconductors, glass, polymers et al. This electroless process is suitable for applications in microelectronics and ultralarge-scale integration technology as well as in advanced chip packaging and solar cells. NANO3D’s Electroless AgW can be plated onto sub-5 μm features when used in conjunction with NANO3D’s Photopatternable Catalytic Resist and NANO3D’s Electroless Nickel (Cobalt)Tungsten Phosphorus Plating. The formulation of NANO3D’s Electroless AgW Plating solution provides excellent throwing power.

Safety & Documentation

Safety Information

Download Safety Data SheetContact NANO3D SYSTEMS LLC for Certificate of Analysis.

SPECIFICATION (Rev. 1 090307)

ELP-EL4AW-30A-01

Silver-Tungsten Electroless Plating Stock Solution

 

COMPOSITION:       

 

SPECIFICATION

TEST method

      ASSAY

 

 

            AgNO3

5 ± 0.1 g/L

Titration

 

 

 

     Na2WO4 2H2O

20 ± 1 g/L

Titration

 

         Benzoic Acid  

 

40 ± 2 g/L

Titration

      Additives

 

             pH

 

Trade Secret

 

9.1 ± 0.2 @ 23 ± 1 C

 

HPLC

 

pH meter

 

Metals

Al (Aluminum)

 

< 10 ppm

 

ICPMS

 

 

 

 

As (Arsenic)

 

< 10 ppm

 

ICPMS

 

 

 

Au (gold)

< 10 ppm

ICPMS

 

 

 

Ca (Calcium)

< 10 ppm

ICPMS

 

 

 

Cd (Cadmium)

< 10 ppm

ICPMS

 

 

 

Co (Cobalt)

< 10 ppm

ICPMS

 

 

 

Cr (Chromium)

< 10 ppm

ICPMS

 

 

 

Fe (Iron)

<10 ppm

ICPMS

 

 

 

In (indium)

< 10 ppm

ICPMS

 

 

 

Mg (Magnesium)

< 10 ppm

ICPMS

 

 

 

Mn (Manganese)

< 10 ppm

ICPMS

 

 

 

K (Potassium)

<100 ppm

ICPMS

 

 

 

Ni (Nickel)

< 10 ppm

ICPMS

 

 

 

Pb (Lead)

< 10 ppm

ICPMS

 

 

 

Sn (Tin)

< 10 ppm

ICPMS

 

 

 

Tl (Thallium)

< 10 ppm

ICPMS

 

 

 

Zn (Zinc)

< 10 ppm

ICPMS

 

 

 

        

 

 

Particles                   

(> 0.25 mm)

 

 

≤ 200 counts/ml

 

 

Laser Particle Counter

 

SHELF LIFE:    This solution has 12 months shelf life.

 

PACKAGING:    1 liter poly bottle or 5 liter poly Jerrican, meeting UN requirements, unless otherwise specified.

 

 

 

Additional Info

OPERATING CONDITIONS

Formulation of NANO3D’s Electroless AgW plating solution

W/W (%)

Electroless AgW plating Stock Solution

> 99 %

Hydrazine

0.4 – 0.8 g/l

Temperature

18°C – 40 °C

Deposition rate

~ 50 nm/min @ RT

pH

9.1 ± 0.2