About Nano3D Systems
Nano3D Systems was founded in 2008 by Dr. Val Dubin to create a metallization process suitable for the next generations in microsystems manufacturing.
Dr. Dubin is a recognized expert in the materials processing and semiconductor fields, with over 30 years experience and over 300 patents and publications. The Nano3D Systems’ management team has a combined 150 years of experience with both innovative start-up companies and global leaders.
At NANO3D SYSTEMS LLC we develop and supply customers a wide range of metal deposition products, backed by industry finest customer support and technical expertise. Capabilities include high-purity specialty chemicals formulation and manufacturing at ISO 9001:2015 certified
Our Mission & Vision
Nano3D Systems provides revolutionary eLOCOSTM metallization technology and proprietary process chemicals to enable novel 3D microsystems and chipset architectures on a wide variety of substrates.
To be a leading supplier of metallization technology and process materials that enable life changing breakthroughs .
What we can do?
- Through-substrate holes and blind vias plating for advanced packaging.
- Electroless metal photo-patterning on flexible or rigid substrates.
- Plating of controlled expansion interconnects.
- Metal encapsulation of microparticles and carbon fibers.
- ALD and CVD of ultra-thin films using metal-organic precursors.
- And more…ask about our R&D and process development services.
Void-free plating of high-aspect-ratio blind and through-substrate vias in glass, silicon and polymers.
Electroless Metal Photo-Patterning
UV-litho or laser direct imaging of photosensitive catalytic nanolayers followed by selective plating.
Conformally coated microparticles
Metal shells over regular or irregularly shaped small particles.
eLOCOS(TM) Plating Solutions
Electroplating and electroless plating solutions, photoplating solutions and process development. Controlled metallization of fine features for high-tech applications at reduced costs.
Nano3D Systems’ exclusive catalytic photoresist can be dipped, spun or sprayed onto a wide variety of substrates. Patterns can be generated with standard UV photolithography or maskless laser lithography.
Low cost & Scalable
eLOCOS(TM) solutions are appropriate for both low-volume proof-of-concept or R&D projects and high-volume production lines. Nano3D Systems??proprietary plating materials can reduce metallization costs by 1/3 or more.
Flexible and adaptable
Processes can be adjusted to fit your needs.