NANO3D SYSTEMS is pleased to be nominated as a semifinal competitor of The Innovation & Entrepreneurship Competition for International Talents 2019 in Hangzhou, China. We see this nomination as an opportunity for our eLOCOS(TM) plating technology to expand into the Chinese market and establish NANO3D’s presence in China. eLOCOS(TM) technology enables small form factor, affordable, reliable 2.5D/3D microsystems and fine-pitch bumps. It overcomes the key technical roadblocks in manufacturing of fine-pitch, large area, multi-layer, flexible printed circuit boards and high density interconnects for 2.5D interposers, 3D IC, power electronics et al.
As per the findings of a business intelligence report published by IndustryARC, Asia-Pacific occupied a dominating regional share of 40% in the global electroplating market. It was valued at $15B in 2018 and it is estimated to grow with a healthy compound annual growth rate (CAGR) of 4% during the forecast period 2019-2025. Through 2024, electronics will remain the largest end-use market, followed by the automotive sector. China accounts for 21% of advanced chip packaging revenue (~$30B) in Y2018 (Taiwan 52%, US – 15%). China is the #1 manufacturer of smart phones with ~38.8% market share. China is also the #1 manufacturer of automotive’s with ~28 millions annual car sales.
The semifinal competition and grand finals will be held in Hangzhou in November 2019. Hangzhou International Human Resources Exchanges and Cooperation Conference will be held concurrently. Through visits and match-making meetings, the teams have excellent opportunity to personally learn about Hangzhou, witness the mix of nature beauty and modernization of Hangzhou, and see the ecosystem of various high-tech industry parks. Furthermore through this event, teams make friends all over the world and find potential business partners. In many instances, no matter whether winning the final or not, every team is a winner in this event! HERE is a video presentation for the 2018 Competition.