NANO3D SYSTEMS is pleased to be nominated to the 2017 World Materials Forum Start Up Challenge. We see this nomination as an opportunity for our eLOCOS(TM) plating technology to be part of WMF’s mission to achieve the
objective of materials efficiency for better growth with materials/IOT
industry leaders throughout the world. World Materials Forum (WMF) was held on June 29 – 30th in Nancy, France.
This year forum includes about 260 invited C–suite participants in
materials / IOT companies throughout the world. It’s different than
conventional industry forums – only thought leaders and company
executives across industries driving new technologies for
sustainability. This leads to a fascinating network and information
WMF asked Nano3D Systems’ president Val Dubin to describe Nano3D’s
breakthrough technology and its contribution to the WMF Overall
Objective of “Material Efficiency for Better Growth.” Dr. Dubin’s
“NANO3D provides revolutionary eLOCOS metallization technology for
advanced 3D devices. NANO3D addresses $15.3B metal plating market
opportunity that needs advanced plating technology to decrease the
interconnect feature sizes and increase the power density for next
generation consumer and power electronic devices.
NANO3D’s patented eLOCOS plating technology is based on novel materials
a) drastically increase the interconnect density by selectively
plating ultra-small features of high aspect ratios to reduce the form
b) fabricate controlled expansion interconnects by plating alloys with
unique properties to eliminate CTE mismatch between buildup materials.
We partner with major plating tool suppliers and R&D
consortiums to qualify NANO3D’s process technology and plating
chemicals, and then scale up the production of materials through toll
manufacturing and licensing to established chemical companies.
NANO3D additive metallization technology drastically reduces the usage
of copper and polishing slurry to fabricate multichip interconnects to
enable small form factor, affordable and reliable 3D microsystems. “