Technology Enhancement for Commercial Partnership – TECP
“Technology Enhancement for Commercial Partnership – TECP” project with ClassOne Technology Inc. on INVAR plating was successfully completed as supplemental support to NSF SBIR Phase II project.
The quality of NANO3D teamwork was recognized and appreciated by ClassOne functional team members and the customers. In short period of time, NANO3D team was able to develop proprietary formulation of plating solution for electroplating of controlled expansion alloy films with controlled composition, low internal stress and low CTE. Wafer level data using ClassOne plating tool were also collected and superior film properties were demonstrated. NANO3D team developed bath metrology methods for plating solution quality control that meet p/t requirements. Production of controlled expansion alloy plating chemicals were established using toll manufacturing with EHS, DOT, QC procedures in place to supply plating chemicals to customers. Thank you NANO3D team for the outstanding work during the TECP project.
Thank you, Kevin. It was great to work with you and ClassOne team. Really appreciate it. Since completion of TECP project, we supplied INVAR plating solution and controlled-expansion alloy foils to multiple customers for various applications in MEMS, advanced chip packaging and display technologies.