Low-Resistivity Copper Electroless Plating Solution

Packaging

1 liter poly bottle, 1 gallon or 5 gallon pail, meeting UN requirements, unless otherwise specified.

Quality and Deposits Characteristics

• Resistivity of 1.7 – 2 µOhm cm
• Grain Size of 0.1 – 1 µm
• Melting temp of 1085 C
• Density of 8.86-8.76 g/cm3
• Internal Stress of ± 20 to ± 60 N/mm2
• Tensile Strength of 350 – 450 N/mm2
• Microhardness of 610 – 660 N/mm2
• Conformality up to 90%
• Thickness continuity < 10 nm
• Texture <111>
• Roughness Ra of 70 nm for 3 µm thick copper film
• Impurities (O, N, C, C, K, Na, H, Cl) < 100 ppm
• Adhesion to dielectric substrates > 65 MPa
• EM MTF > 1000 hours

Features and Benefits

• Low resistivity electoless copper
• Conformal electroless Cu films
• High throwing power
• Selective plating
• Surfaces are uniform and smooth with well-controlled thickness and excellent uniformity
• Qualified bath metrology for replenishment and a long shelf life

General description

Electroless Copper Plating is an electroless alkaline copper process engineered for plating copper patterns and redistribution layers as well as filling vias and trenches on wide varieties of substrates including semiconductors, glass, polymers et al. NANO3D’s Electroless Copper Plating process can be plated onto sub-5 μm features when used in conjunction with NANO3D’s Photopatternable Catalytic Resist and NANO3D’s Electroless Nickel (Cobalt)Tungsten Phosphorus Plating. The formulation of NANO3D’s Electroless Copper Plating solution provides excellent throwing power.