Low-Resistivity Copper Electroless Plating Solution

$22.74$295.71

Clear
Share: 0
SKU: ELP-EL1-36A-01 Category: .

Product Details

Purchase

Description

Packaging

1 liter poly bottle, 1 gallon or 5 gallon pail, meeting UN requirements, unless otherwise specified.

Quality and Deposits Characteristics

  • Resistivity of 1.7 – 2 µOhm cm
  • Grain Size of 0.1 – 1 µm
  • Melting temp of 1085 C
  • Density of 8.86-8.76 g/cm3
  • Internal Stress of ± 20 to ± 60 N/mm2
  • Tensile Strength of 350 – 450 N/mm2
  • Microhardness of 610 – 660 N/mm2
  • Conformality up to 90%
  • Thickness continuity < 10 nm
  • Texture <111>
  • Roughness Ra of 70 nm for 3 µm thick copper film
  • Impurities (O, N, C, C, K, Na, H, Cl) < 100 ppm
  • Adhesion to dielectric substrates > 65 MPa
  • EM MTF > 1000 hours

Features and Benefits

  • Low resistivity electoless copper
  • Conformal electroless Cu films
  • High throwing power
  • Selective plating
  • Surfaces are uniform and smooth with well-controlled thickness and excellent uniformity
  • Qualified bath metrology for replenishment and a long shelf life

General description

Electroless Copper Plating is an electroless alkaline copper process engineered for plating copper patterns and redistribution layers as well as filling vias and trenches on wide varieties of substrates including semiconductors, glass, polymers et al. NANO3D’s Electroless Copper Plating process can be plated onto sub-5 μm features when used in conjunction with NANO3D’s Photopatternable Catalytic Resist and NANO3D’s Electroless Nickel (Cobalt)Tungsten Phosphorus Plating. The formulation of NANO3D’s Electroless Copper Plating solution provides excellent throwing power.

 
 

Safety & Documentation

Safety Information

Download Safety Data Sheet Contact NANO3D SYSTEMS LLC for Certificate of Analysis.


SPECIFICATION (Rev. 1 090307)

ELP-EL1-36A-01
Electroless Cu Plating Stock Solution

ASSAYSPECIFICATIONTEST METHOD
CuSO4 5 H2O5.0 ± 0.1 g/LTitration
EDTA20.0 ± 1 g/LTitration
Wetting Agent40 ± 4 mg/L

HPLC

pH12.5 ± 0.2 @ 23 ± 1 CpH meter

Metals

 

Al (Aluminum)

 

 

< 10 ppm

 

 

ICPMS

 

 

 

 

As (Arsenic)

 

< 10 ppm

 

ICPMS

 

 

 

Au (gold)

< 10 ppm

ICPMS

 

 

 

Ca (Calcium)

< 10 ppm

ICPMS

 

 

 

Cd (Cadmium)

< 10 ppm

ICPMS

 

 

 

Co (Cobalt)

< 10 ppm

ICPMS

 

 

 

Cr (Chromium)

< 10 ppm

ICPMS

 

 

 

Fe (Iron)

<10 ppm

ICPMS

 

 

 

In (indium)

< 10 ppm

ICPMS

 

 

 

Mg (Magnesium)

< 10 ppm

ICPMS

 

 

 

Mn (Manganese)

< 10 ppm

ICPMS

 

 

 

K (Potassium)

<100 ppm

ICPMS

 

 

 

Na (Sodium)

< 100 ppm

ICPMS

 

 

 

Ni (Nickel)

< 10 ppm

ICPMS

 

 

 

Pb (Lead)

< 10 ppm

ICPMS

 

 

 

Sn (Tin)

< 10 ppm

ICPMS

 

 

 

Tl (Thallium)

< 10 ppm

ICPMS

 

 

 

Zn (Zinc)

< 10 ppm

ICPMS

 

 

 


 

Particles                    
(> 0.25 mm)

 

≤ 200 counts/ml

 

Laser Particle Counter

SHELF LIFE:  This solution has 12 months shelf life.

PACKAGING: 1 liter poly bottle, 1 gallon or 5 gallon pail, meeting UN requirements, unless otherwise specified.

Additional Info

OPERATING CONDITIONS

Formulation of NANO3D’s Electroless Cu plating solutionW/W (%)
Electroless Cu plating Stock Solution> 98 %
Glyoxylic Acid10 – 20 g/l
Temperature55 °C – 80 °C
Deposition rate~ 150 nm/min @ 80 oC
pH12.5 ± 0.2