Copper-Zinc Electroless Plating Solution

$35.10$145.50

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SKU: ELP-EL1Z-36C-01 Category: .

Product Details

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Description

Packaging

1 liter poly bottle or 5 liter HDPE Jerrican, meeting UN requirements, unless otherwise specified.

Quality and Deposits Characteristics

  • Resistivity of CuZn2.95% – 7.5 µOhm cm
  • Grain Size of 0.1 – 1 µm
  • Density of 8.7-8.8 g/cm3
  • Conformality up to 90%
  • Thickness continuity < 10 nm
  • Texture <111>
  • Adhesion to dielectric substrates > 65 MPa

Features and Benefits

  • High corrosion resistance
  • Conformal electroless CuZn films
  • High throwing power
  • Selective plating
  • Surfaces are uniform and smooth with well-controlled thickness and excellent uniformity

General description

Electroless Copper-Zinc Plating is an electroless alkaline copper process engineered for plating corrosion-resistant CuZn alloys on varieties of substrates including semiconductors, glass, polymers et al.   The formulation of NANO3D’s Electroless Copper-Zinc Plating solution provides excellent throwing power.

 
 

Safety & Documentation

Safety Information

Download Safety Data Sheet . Contact NANO3D SYSTEMS LLC for Certificate of Analysis.

SPECIFICATION (Rev. 1 090307A)

ELP-EL1Z-36C-01

Stock Solution EL1Z for Electroless CuZn Plating

COMPOSITION:

 
SPECIFICATION
TEST method
      ASSAY  
            Cu(NO3)215 ± 0.75 g/LSpectrophotometry
   
            K-Na tartrate30 ± 1.5 g/LTitration
  ZnCl2  0.5 ± 0.05 g/L  Spectrophotometry
  Na2CO3  10 ± 0.05 g/L  Titration
   
      Surfactant RE0.1 ± 0.01 g/LCVS
   
      Stabilizer DP50 ± 5 mg/lCVS
   
   
            pH (KOH)12 – 12.5pH meter
   
   
   
      Particles  
            (> 0.25 mm)≤ 300 counts/mlLaser Particle Counter

                                                                                    

SHELF LIFE:    12 months  

 

PACKAGING:  1 L poly bottle and 5L HDPE Jerrican, meeting UN requirements, unless otherwise specified.

Additional Info

OPERATING CONDITIONS

Formulation of Electroless CuZn plating solutionW/W (%)
Electroless CuZn plating Stock Solution> 96 %
Glyoxylic Acid30 – 50 g/l
Temperature18 °C – 35 °C
pH12.3 ± 0.2