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Copper-Plated Through-Holes for 3D Electro-Thermal Systems
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“Copper-Plated Through-Holes for 3D Electro-Thermal Systems” was presented at the 233rd ECS Meeting in Seattle, WA
“Copper-Plated Through-Holes for 3D Electro-Thermal Systems” was presented at the 233rd ECS Meeting in Seattle, WA
NANO3D’S PLATING TECHNOLOGY FOR 2.5D/3D HIGH DENSITY INTERCONNECTS Electrochemical deposition processes for 2.5D/3D interconnects developed at NANO3D SYSTEMS LLC offer superior performance and substantially lower cost compared to conventional processes. NANO3D’s processes are based on novel electrochemical nano-materials such as plating solutions with self-assembled suppression-based organic additives to achieve void-free bottom up gap fill and […]
Read More »The coronavirus will leave an enormous impact on how we consume, learn, work, socialize and communicate. This pandemic has also shown us how important PPE (personal protection equipment) is in fighting the deadly contagious diseases such COVID-19. Wearing a protective facemask, especially for medical professionals who are in the forefront of the fight against the […]
Read More »Val Dubin, founder and president of NANO3D SYSTEMS LLC, was awarded the third prize at the Innovation and Entrepreneurship Competition. The weeklong competition took place November 2019 in Hangzhou, Zhejiang province in China. There were a record number of entries for this prestigious competition with over 1600 applicants from various companies around the world, which […]
Read More »NANO3D SYSTEMS is pleased to be nominated as a semifinal competitor of The Innovation & Entrepreneurship Competition for International Talents 2019 in Hangzhou, China. We see this nomination as an opportunity for our eLOCOS(TM) plating technology to expand into the Chinese market and establish NANO3D’s presence in China. eLOCOS(TM) technology enables small form factor, affordable, reliable 2.5D/3D microsystems […]
Read More »NANO3D SYSTEMS, LLC has successfully completed NSF SBIR Phase II/IIB project. Project Outcomes Report for award # 1456385 is available in Research.gov. To expand commercialization efforts of NSF SBIR related products such as plating solutions for High Speed (> 4 µm/min) Copper Deposition and Controlled-Expansion (CTE < 2 ppm) Nickel-Iron Alloy Interconnects et al. We […]
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