Palladium Electroplated Foils


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SKU: EM-FPA-TS-04 Category: .

Product Details

Quality and Foils Characteristics
  • Density of 12.023 g/cm3(lit.)
  • Melting point of 1554.9 °C (lit.)
  • Resistivity 10.45 μΩ-cm, 20°C
  • Young Modulus of 100 GPa
  • Elastic limit up to 400 MPa
  • Texture (111) and (200)
  • Grain sizes in the range of 10 – 25 nm

Features and Benefits

  • Foils have low internal stress
  • Foils are pin-hole free (light testing)
  • Surfaces are uniform and smooth with well-controlled thickness and excellent uniformity
  • As plated Pd films are nanocrystalline.

General description

Palladium electroplating process is designed for the fabrication of low stress, smooth and nano-structured palladium films. Electroplated Palladium foils are low stress, smooth and pinhole-free.


Safety & Documentation

Safety Information

Download Safety Data SheetContact NANO3D SYSTEMS LLC for Certificate of Analysis.



EM-FPA-TS-04 (Thickness x Size)

SPECIFICATION                                  TEST method

Pd (Wt.%) > 99.9%                                          EDX

Pin-Hole Free                                               Light


Foils thickness: 10 µm, unless otherwise specified (from 5 µm to 100 µm)

Foil sizes:          25 x 25 mm, 50 x 50 mm, 100 x 100 mm and 200 x 200 mm