$95.00 – $292.00
Packaging 1 pound of Part A (powder) in 1 liter wide mouth packer (HDPE) or 5 pounds of Part A in 2 gallon pail and 1 pint of Part B (liquid) in 16 oz natural poly bottle or 1/2 gallon of Part B in 4 L natural poly bottle, meeting UN requirements, unless otherwise specified
Quality and Deposits Characteristics
Features and Benefits
Simple immersion technique for bright electroless tin plating process. Deposit pure tin onto copper, brass, other copper-based alloys, gold and lead-tin electroplate. Bright Electroless Tin is a well-developed formulation based upon the reduction characteristics of chelated tin in the divalent state. Under proper conditions reduction to pure tin occurs readily. Bright Electroless Tin is recommended to preserve solderability of printed circuit boards, either copper of lead-tin electroplate. It is also used for plating electronic parts, such as diodes leads and for the corrosion protection of die stampings and machined copper or brass parts.
Download Safety Data Sheet of Part A and Part B. Contact NANO3D SYSTEMS LLC for Certificate of Analysis
SPECIFICATION (REV. 1 020419)
Bright Electroless Tin Solution
Tin Metal content (Part A) – 92.3-93.3 g/kg
pH (Part B) – < 1
To prepare the electroless tin plating solution use one pound Part A with one pint Part B and add 0.6 gallons water. Stir. All material will dissolve when plating solution is operated at 180oF.
SHELF LIFE: This solution has 12 months shelf life.
PACKAGING: 1 pound of Part A (powder) in 1 liter wide mouth packer (HDPE) or 5 pounds of Part A in 2 gallon pail and 1 pint of Part B (liquid) in 16 oz natural poly bottle or 1/2 gallon of Part B in 4 L natural poly bottle. Larger packages are also available upon request.
PLATING RATE (on copper)
|Time in minutes||Thickness in Microinches|
|( @ 180oF)||( 10-6 inches)|
Bright Electroless Tin will deposit 25 millionths of an inch over 100 sq. ft. of copper/gallon of plating solution.