$96.30 – $309.16
Photopatternable Catalytic Resist is a spray-, dip-, or spin-deposited solution that can be patterned using UV-irradiation. The photopatterned catalytic resist is used for electroless deposition of various metals and metal alloys with feature sizes and spacings as small as ˂ 5 μm. NANO3D’s photopatternable catalytic resist can coat surfaces conformally, allowing high-resolution electroless metal deposition onto complex substrate geometries
|Formulation of Photopatternable Catalytic Resist||Composition|
|Part A||titaniumbutoxide in IPA|
|Part B||oxalic acid in IPA|
|Part C||PdCl2/HCl in IPA|
1. Substrate Cleaning: Substrates should be degreased by sonication in appropriate organic solvents. Degreasing should be followed by cleaning in air plasma. Plasma cleaning also improves adhesion of the solution to the substrate.
2. Solution Mixing: The titanium butoxide (Part A) and oxalic acid (Part B) solutions should be mixed in a 1 to 1 ratio (v:v) 24 hours before use. The palladium chloride solution (Part C) should be added to the combined titanium butoxide/oxalic acid solution immediately prior to deposition to a titanium butoxide (Part A) : oxalic acid (Part B) : palladium chloride (Part C) solution ration of 1:1:0.02. For example, mix 100 ml Part A + 100 ml Part B + 2 ml Part C to prepare 202 ml catalytic photoresist.