$34.25 – $95.50
100 ml and 500 ml poly bottles, meeting UN requirements, unless otherwise specified.
Glyoxylic acid is used as a reducing agent in NANO3D’s formaldehyde-free Electroless Copper Platingengineered for platingcopper patterns and redistribution layers as well as filling vias and trenches on wide varieties of substrates including semiconductors, ceramics, glass, polymers et al. NANO3D’s Electroless Copper Plating process can be plated onto sub-5 μm features when used in conjunction with NANO3D’s Photopatternable Catalytic Resist and NANO3D’s Electroless Nickel (Cobalt)Tungsten Phosphorus Plating. The formulation of NANO3D’s Electroless Copper Plating solution provides excellent throwing power.
Glyoxylic Acid Solution
|Assay||50 ± 4 wt.% in DI H2O||Titration|
|Appearance (color)||Colorless to Yellow|
|Appearance (form)||Viscous liquid|
|(> 0.25 m)||≤ 200 COUNTS/ML||Laser Particle Counter|
SHELF LIFE: This solution has 12 months shelf life.
PACKAGING: 100 ml and 500 ml poly bottles, meeting UN requirements, unless otherwise specified.