Glyoxylic Acid Solution

$34.25$93.50

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SKU: ELNP-RA1A-100A-01 Category: .

Product Details

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Description

Packaging

100 ml and 500 ml poly bottles, meeting UN requirements, unless otherwise specified.

Properties

  • Concentration – 50wt. % in DI H2O
  • Density – 1.342 g/mL at 25 oC
  • Refractive index – n20/D 1.4149

Features and Benefits

  • Non-alkaline reducing agent
  • Non-carcinogenic reducing agent
  • Qualified bath metrology for replenishment and a long shelf life

General description

Glyoxylic acid is used as a reducing agent in NANO3D’s formaldehyde-free Electroless Copper Platingengineered for platingcopper patterns and redistribution layers as well as filling vias and trenches on wide varieties of substrates including semiconductors, ceramics, glass, polymers et al. NANO3D’s Electroless Copper Plating process can be plated onto sub-5 μm features when used in conjunction with NANO3D’s Photopatternable Catalytic Resist and NANO3D’s Electroless Nickel (Cobalt)Tungsten Phosphorus Plating. The formulation of NANO3D’s Electroless Copper Plating solution provides excellent throwing power.

 
 

Safety & Documentation

Safety Information

Download Safety Data Sheet Contact NANO3D SYSTEMS LLC for Certificate of Analysis.


SPECIFICATION (Rev. 1 090307)

 

ELNP-RA1A-100A-01
Glyoxylic Acid Solution

TESTSPECIFICATIONTEST method
Assay50 ± 4 wt.% in DI H2OTitration
Appearance (color) Colorless to Yellow 
Appearance (form)Viscous liquid 

Particles

(> 0.25 m)≤ 200 COUNTS/MLLaser Particle Counter

SHELF LIFE: This solution has 12 months shelf life.

PACKAGING: 100 ml and 500 ml poly bottles, meeting UN requirements, unless otherwise specified.