$149.97 – $336.60
1 pint of Part A and Part B, 1 quart of Part C and Part D or 1 gallon kits (each of Part A, Part B, Part C and Part D) in poly containers meeting UN requirements, unless otherwise specified.
Quality and Deposits Characteristics
Features and Benefits
Adherent copper deposition system for through-hole plating of printed circuit boards (PCBs), plastics and other substrates.
Download Safety Data Sheet of Part A, Part B, Part C and Part D. Contact NANO3D SYSTEMS LLC for Certificate of Analysis.
SPECIFICATION (Rev. 1 091520)
Electroless Copper Kit for Plating on PCB Substrates
PLATING KIT FORMULATION:
|ELECTROLESS COPPER BATH PART A|
ELECTROLESS COPPER BATH PART B
SHELF LIFE: These solutions have 12 months shelf life.
PACKAGING: The standard Electroless Cu PCB kit ships in poly pints (Part A, B) & quarts (Part C, D) and gallons for each of Part A, B, C and D. Larger packages are also available upon request.
MATERIALS FOR PLATING NON-METAL, THROUG-HOLE PLATED PCBs:
Solutions should be used in the following order:
Immerse pre-cleaned copper-clad epoxy/glass laminates in Solution C for 2 minutes. Do not stir or agitate the solution. Avoid contamination from metal objects. Use glassware and plastic-coated tweezers or transfer racks for handling. Remove surface sensitized pieces; after water rinse, transfer to next solution.
PCBs should be allowed to stand in Solution D for 2 minutes. Again, do not agitate or stir. Finally, remove work and thoroughly rinse in distilled water.
Bath Make Up: Mix A & B in equal volumes.
Operation of Bath: Use at 30-45oC (not over 50oC). Bath should be held at optimum operation temperature of 40oC for uniform plating thickness. Continuous mild agitation of work. Nominal plating rate 0.2 mil/hour. PCB Electroless Copper is used for depositing thin layers of copper, up to 0.5 microns. For thicker films, NANO3D High Speed Bright Copper Electoplating Solution should be used after initial electroless copper deposition. The copper content is 16 grams/gallon.