Electroless Copper Kit for Plating on PCB Substrates

$149.97$336.60

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SKU: EM-EL15K-PCB-01 Category: .

Product Details

Description

Packaging

1 pint of Part A and Part B, 1 quart of Part C and Part D or 1 gallon kits (each of Part A, Part B, Part C and Part D) in poly containers meeting UN requirements, unless otherwise specified.

Quality and Deposits Characteristics

  • Conformal electroless Cu seed plating for through-holes on PCB substrates.
  • Excellent bond strength.
  • Low electrical resistivity.

Features and Benefits

  • Low cost metallization process.
  • Low temperature metallization process.  
  • Process applicable to PCBs, plastics and other materials.

General Description

Adherent copper deposition system for through-hole plating of printed circuit boards (PCBs), plastics and other substrates. 

Safety and Documentation

Safety Information

Download Safety Data Sheet of Part A, Part B, Part C and Part D. Contact NANO3D SYSTEMS LLC for Certificate of Analysis.

SPECIFICATION (Rev. 1 091520)

EM-EL15K-PCB-01

Electroless Copper Kit for Plating on PCB Substrates

PLATING KIT FORMULATION:

 

 SURFACE SENSITIZING

ACTIVATION

ELECTROLESS COPPER BATH PART A

ELECTROLESS COPPER BATH PART B 

COPPER ELECTROPLATING

 SOLUTION C

SOLUTION D

SOLUTION A

SOLUTION B

ELECTROPLATING SOLUTION

     

SHELF LIFE:    These solutions have 12 months shelf life.

PACKAGINGThe standard Electroless Cu PCB kit ships in poly pints (Part A, B) & quarts (Part C, D) and gallons for each of Part A, B, C and D. Larger packages are also available upon request.

Additional Info

OPERATION INSTRUCTIONS

MATERIALS FOR PLATING NON-METAL, THROUG-HOLE PLATED PCBs:

 

Solutions should be used in the following order:

  1. Solution C;
  2. Solution D;
  3. Solutions A & B.

 

  • SURFACE SENSITIZING (SOLUTION C)

Immerse pre-cleaned copper-clad epoxy/glass laminates in Solution C for 2 minutes. Do not stir or agitate the solution. Avoid contamination from metal objects. Use glassware and plastic-coated tweezers or transfer racks for handling. Remove surface sensitized pieces; after water rinse, transfer to next solution.

  • ACTIVATOR (SOLUTION D)

PCBs should be allowed to stand in Solution D for 2 minutes. Again, do not agitate or stir. Finally, remove work and thoroughly rinse in distilled water.

  • PCB ELECTROLESS COPPER BATH (SOLUTIONS A & B)

Bath Make Up: Mix A & B in equal volumes.

Operation of Bath: Use at 30-45oC (not over 50oC). Bath should be held at optimum operation temperature of 40oC for uniform plating thickness. Continuous mild agitation of work. Nominal plating rate 0.2 mil/hour. PCB Electroless Copper is used for depositing thin layers of copper, up to 0.5 microns. For thicker films, NANO3D High Speed Bright Copper Electoplating Solution should be used after initial electroless copper deposition.  The copper content is 16 grams/gallon.