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$197.92 – $375.73
500 ml and 1 liter poly bottles, meeting UN requirements, unless otherwise specified.
Electroless suppressor additive is formulated to be used in copper electroless plating solutions for void-free filling of vias and trenches on wide varieties of substrates including semiconductors, glass, polymers et al. Suppressor enhances bottom-up fill in recessed features (vias and trenches), eliminates plating solution decomposition and reduces the surface tension of copper electroless plating solutions.
Download Safety Data Sheet. Contact NANO3D SYSTEMS LLC for Certificate of Analysis.
COMPOSITION:
| SPECIFICATION | TEST method |
ASSAY |
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SU19 | 2.1 ± 0.2 a.u. | HPLC |
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METALS |
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Al (Aluminum) | < 1 ppm | GFAA/ICPOES |
Au (Gold) | < 1 ppm | GFAA/ICPOES |
As (Arsenic) | < 1 ppm | GFAA/ICPOES |
Ag (Silver) | < 1 ppm | GFAA/ICPOES |
Ca (Calcium) | < 1 ppm | GFAA/ICPOES |
Cd (Cadmium) | < 1 ppm | GFAA/ICPOES |
Co (Cobalt) | < 1 ppm | GFAA/ICPOES |
Cr (Chromium) | < 1 ppm | GFAA/ICPOES |
Fe (Iron) | < 1 ppm | GFAA/ICPOES |
In (Indium) | < 1 ppm | GFAA/ICPOES |
Mg (Magnesium) | < 1 ppm | GFAA/ICPOES |
Mn (Manganese) | < 1 ppm | GFAA/ICPOES |
Ni (Nickel) | < 1 ppm | GFAA/ICPOES |
Pb (Lead) | < 1 ppm | GFAA/ICPOES |
Sn (Tin) | < 1 ppm | GFAA/ICPOES |
Tl (Thallium) | < 1 ppm | GFAA/ICPOES |
Zn (Zinc) | < 1 ppm | GFAA/ICPOES |
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Particles |
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(> 0.25 mm) | ≤ 200 counts/ml | Laser Particle Counter |
SHELF LIFE: 12 months
PACKAGING: 500 ml and 1 liter polyethylene bottles. Other packages are available upon request
Suppressor (SU 19) reduces surface tension of copper electroless plating solution and promotes void-free fill of recessed features (trenches and vias).
