$540.00 – $2,160.00
1 quart or 4 quart kits (Part A and Part B) in containers meeting UN requirements, unless otherwise specified
Quality and Deposits Characteristics
Features and Benefit
Electroless Gold is a two part system suitable for producing bright gold films on metal surfaces via an electroless plating process. Electroless Gold process takes advantage of catalytic metals to plate gold films with good adhesion on substrates containing catalytic metals (Cu, Ni, Co, Fe, Ag, Pd, Ru et al). Electroless Gold deposits gold on high – and low – phosphorus nickel as well as copper. Electroless gold plating solution can be also used to fill vias and trenches for onchip interconnects and 2.5D/3D advanced chip packaging applications.
Download Safety Data Sheet of Part A and Part B. Contact NANO3D SYSTEMS LLC for Certificate of Analysis
SPECIFICATION (Rev. 1 030520)
Electroless Gold Plating Solution
Au Metal content (Part A) – 0.2 tr oz/gal
pH (Part A+B) – 12
To prepare 4 quart of immersion gold plating solution use 3,600 ml Part A with 180 ml Part B. Stir. All material will dissolve when plating solution is operated at 70-75 oC.
SHELF LIFE: This solution has 12 months shelf life.
PACKAGING: For electroless gold quart kit, packaging includes 1 quart natural poly bottle of Part A and 4 oz natural poly bottle of Part B. For electroless gold gallon kit, packaging includes 4 L natural poly bottle of Part A and 8 oz natural poly bottle of Part B. Larger packages are also available upon request.
|Mix Ratio||20 : 1 for Part A : Part B|
|Gold Content||0.2 tr oz / gal|
|Plating Rate||~ 1.5 µ/min at 75 C|
APPLICATION: Nickel and copper should be cleaned in dilute hydrochloric acid (approximately 10%) prior to plating. The pH should be adjusted and maintained in the range 12.0-12.4 for best results. Part B should be added to the plating tank followed by Part A with stirring. Allow parts to mix for 5-10 minutes before use.
The image of electroless gold foil (~2 micron thick) plated in optimal conditions is shown below