Copper-Zinc Electroless Plating Solution

Packaging

1 liter poly bottle or 5 liter HDPE Jerrican, meeting UN requirements, unless otherwise specified.

Quality and Deposits Characteristics

• Resistivity of CuZn2.95% – 7.5 µOhm cm
• Grain Size of 0.1 – 1 µm
• Density of 8.7-8.8 g/cm3
• Conformality up to 90%
• Thickness continuity < 10 nm
• Texture <111>
• Adhesion to dielectric substrates > 65 MPa

Features and Benefits

• High corrosion resistance
• Conformal electroless CuZn films
• High throwing power
• Selective plating
• Surfaces are uniform and smooth with well-controlled thickness and excellent uniformity

General description

Electroless Copper-Zinc Plating is an electroless alkaline copper process engineered for plating corrosion-resistant CuZn alloys on varieties of substrates including semiconductors, glass, polymers et al.   The formulation of NANO3D’s Electroless Copper-Zinc Plating solution provides excellent throwing power.