Immersion Gold Plating Solution


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SKU: ELPI – EL3G-100A-01 Category: .

Product Details



1 quart or 4 quart kits (Part A and Part B) in containers meeting UN requirements, unless otherwise specified

Quality and Deposits Characteristics

  • Good chemical resistance
  • Excellent adhesion
  • Corrosion protection to copper and nickel
  • Very solderable deposits

Features and Benefits

  • Cyanide-free formulation
  • Plates pure gold rapidly
  • Plating exhibits fine-grain gold structure
  • Affords unusual resistance to humidity and salt-spray
  • Excellent solderability
  • Process simple to operate and maintain
  • Surfaces are uniform and smooth with well-controlled thickness and excellent uniformity

General Description

Immersion Gold CF is a two part system suitable for producing thin gold films on metal surfaces via an electroless immersion process. The cyanide-free formulation offers reduced toxicity and improved compatibility vs. cyanide formulations. Immersion Gold CF takes advantage of EMF potential differences to plate gold films with good adhesion. Immersion Gold CF deposits gold on high – and low – phosphorus nickel as well as copper.

Safety & Documentation

Safety Information

Download Safety Data Sheet of Part A and Part B. Contact NANO3D SYSTEMS LLC for Certificate of Analysis

SPECIFICATION (Rev. 1 020419)


Immersion Gold Plating Solution


Au Metal content (Part B)                –                       0.5 tr oz/gal

                        pH (Part B)                               –                               9

To prepare 4 quart of immersion gold plating solution use 3,535 ml Part A with 250 ml Part B. Stir. All material will dissolve when plating solution is operated at 70-75 oC.

SHELF LIFE:    This solution has 12 months shelf life.

PACKAGING: For immersion gold CF quart kit, packaging includes 1 quart natural poly bottle of Part A and 4 oz natural poly bottle of Part B. For immersion gold CF gallon kit, packaging includes 4 L natural poly bottle of Part A and 8 oz natural poly bottle of Part B. Larger packages are also available upon request.

Additional Info


Mix Ratio3,535 ml Part A, 250 ml Part B
Gold Content0.5 tr oz / gal
Plating Thickness0.25 µ maximum
pH8.6-9.0 (lower with citric acid)
Operating Temperature70-75oC
Plating RateNi (low phosphorus) 0.025 µ / min Ni (high phosphorus) 0.01 µ / min Cu                               0.04 µ / min
AgitationContinuous, Required

APPLICATION: Nickel and copper should be cleaned in dilute hydrochloric acid (approximately 10%) prior to plating. The pH should be adjusted and maintained in the range 8.6-9.0 for best results. Part A should be added to the plating tank followed by Part B with stirring. Allow the two parts to mix for 5-10 minutes before use.