Suppressor Plating Additive

$157.22$271.35

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SKU: ELN-SU13-225A-01 Category: .

Product Details

Description

Packaging

500 ml and 1 liter poly bottles, meeting UN requirements, unless otherwise specified.

Quality and Characteristics

  • High suppression strength
  • Low surface tension
  • High cloud point (> 80 C) and low foaming

Features and Benefits

  • Act as suppressor in copper electroplating solution
  • Stable additive with large process window
  • High purity and long shelf life

General description

Suppressor plating additive is formulated to be used in copper electroplating solutions for high speed plating of copper bumps, pads, patterns and redistribution layers as well as void-free filling of vias and trenches on wide varieties of substrates including semiconductors, glass, polymers et al. Suppressor enhances bottom-up fill in recessed features (vias and trenches), eliminates dendrites formation during high speed plating and reduces the surface tension of copper plating solutions. NANO3D’s Copper Electroplating process operates in wide range of current densities and provides excellent throwing power, improved levelling characteristics, and ductile low stress deposits. NANO3D copper electroplating processes produces bright copper deposits and smooth surface. 

Safety & Documentation

Safety Information

Download Safety Data Sheet. Contact NANO3D SYSTEMS LLC for Certificate of Analysis.

SPECIFICATION (Rev. 1 090308)

ELN-SU13-225A-01

Suppressor SU13 for Copper Plating Solution

 

COMPOSITION:

 

 

SPECIFICATION

TEST method

      ASSAY

 

 

            SU13

2.2 ± 0.2 a.u.

HPLC

 

 

 

            Cu

0.5 ± 0.05 g/L

Spectrophotometry

 

 

 

 

 

 

      METALS

 

 

 

 

 

            Al    (Aluminum)

< 1 ppm

GFAA/ICPOES

            Au    (Au)

< 1 ppm

GFAA/ICPOES

            As    (Arsenic)

< 1 ppm

GFAA/ICPOES

            Ag    (Silver)

< 1 ppm

GFAA/ICPOES

            Ca    (Calcium)

< 1 ppm

GFAA/ICPOES

            Cd    (Cadmium)

< 1 ppm

GFAA/ICPOES

            Co    (Cobalt)

< 1 ppm

GFAA/ICPOES

            Cr    (Chromium)

< 1 ppm

GFAA/ICPOES

            Fe    (Iron)

< 1 ppm

GFAA/ICPOES

            In     (Indium)

< 1 ppm

GFAA/ICPOES

            Mg   (Magnesium)

< 1 ppm

GFAA/ICPOES

            Mn   (Manganese)

< 1 ppm

GFAA/ICPOES

             Ni     (Nickel)

< 1 ppm

GFAA/ICPOES

            Pb    (Lead)

< 1 ppm

GFAA/ICPOES

            Sn    (Tin)

< 1 ppm

GFAA/ICPOES

            Tl    (Thallium)

< 1 ppm

GFAA/ICPOES

            Zn    (Zinc)

< 1 ppm

GFAA/ICPOES

 

 

 

      Particles

 

 

            (> 0.25 mm)

≤ 200 counts/ml

Laser Particle Counter

SHELF LIFE:    12 months

PACKAGING:  500 ml and 1 liter polyethylene bottles. Other packages are available upon request

Additional Info

Suppressor (S) reduces surface tension of copper plating solution, eliminates dendrites formation and decreases (suppress) Cu plating  rate on the field (flat surface) and side walls vs bottom of recessed features (trenches and vias).