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$157.22 – $271.35
500 ml and 1 liter poly bottles, meeting UN requirements, unless otherwise specified.
Suppressor plating additive is formulated to be used in copper electroplating solutions for high speed plating of copper bumps, pads, patterns and redistribution layers as well as void-free filling of vias and trenches on wide varieties of substrates including semiconductors, glass, polymers et al. Suppressor enhances bottom-up fill in recessed features (vias and trenches), eliminates dendrites formation during high speed plating and reduces the surface tension of copper plating solutions. NANO3D’s Copper Electroplating process operates in wide range of current densities and provides excellent throwing power, improved levelling characteristics, and ductile low stress deposits. NANO3D copper electroplating processes produces bright copper deposits and smooth surface.
Download Safety Data Sheet. Contact NANO3D SYSTEMS LLC for Certificate of Analysis.
COMPOSITION:
| SPECIFICATION | TEST method |
ASSAY |
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SU13 | 2.2 ± 0.2 a.u. | HPLC |
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Cu | 0.5 ± 0.05 g/L | Spectrophotometry |
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METALS |
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Al (Aluminum) | < 1 ppm | GFAA/ICPOES |
Au (Au) | < 1 ppm | GFAA/ICPOES |
As (Arsenic) | < 1 ppm | GFAA/ICPOES |
Ag (Silver) | < 1 ppm | GFAA/ICPOES |
Ca (Calcium) | < 1 ppm | GFAA/ICPOES |
Cd (Cadmium) | < 1 ppm | GFAA/ICPOES |
Co (Cobalt) | < 1 ppm | GFAA/ICPOES |
Cr (Chromium) | < 1 ppm | GFAA/ICPOES |
Fe (Iron) | < 1 ppm | GFAA/ICPOES |
In (Indium) | < 1 ppm | GFAA/ICPOES |
Mg (Magnesium) | < 1 ppm | GFAA/ICPOES |
Mn (Manganese) | < 1 ppm | GFAA/ICPOES |
Ni (Nickel) | < 1 ppm | GFAA/ICPOES |
Pb (Lead) | < 1 ppm | GFAA/ICPOES |
Sn (Tin) | < 1 ppm | GFAA/ICPOES |
Tl (Thallium) | < 1 ppm | GFAA/ICPOES |
Zn (Zinc) | < 1 ppm | GFAA/ICPOES |
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Particles |
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(> 0.25 mm) | ≤ 200 counts/ml | Laser Particle Counter |
SHELF LIFE: 12 months
PACKAGING: 500 ml and 1 liter polyethylene bottles. Other packages are available upon request
Suppressor (S) reduces surface tension of copper plating solution, eliminates dendrites formation and decreases (suppress) Cu plating rate on the field (flat surface) and side walls vs bottom of recessed features (trenches and vias).
