$194.47 – $330.29
1 quart or 1 gallon kits (each of Part A, Part B, Part C and Part D) in poly containers meeting UN requirements, unless otherwise specified
Quality and Deposits Characteristics
Features and Benefits
Low Temperature electroless copper metallizing process for alumina ceramics and other dielectric materials – strongly bonded copper can be plated, laser patterned, soldered, brazed or welded.
Download Safety Data Sheet of Part A, Part B, Part C and Part D. Contact NANO3D SYSTEMS LLC for Certificate of Analysis.
SPECIFICATION (Rev. 1 051419)
Electroless Copper Kit for Plating on Alumina Substrates
PLATING KIT FORMULATION:
ELECTROLESS COPPER DEPOSITION
MECHANICAL or CHEMICAL
SHELF LIFE: These solutions have 12 months shelf life.
PACKAGING: The standard Cu RTM kit ships in poly quarts and gallons for each of Part A, B, C and D. Larger packages are also available upon request.
The low temperature electroless Copper (RTM) process is applicable to metallizing alumina substrates for power electronics, in hybrid and microcircuits, insulated heat skinks, ceramic tubes, windows and terminals. Strong bond structures are produced. Structures with hermetic seals are formed as well.
Cu RTM lends itself productively to the application of maskless patterning technology using laser to fabricate metallization patterns. In this manner, conductive pads may be formed for thin film and hybrid circuits.