Electroless Copper Kit for Plating on Alumina Substrates

$194.47$330.29

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SKU: ELN-EL14K-RTM-02 Category: .

Product Details

Description

Packaging

1 quart or 1 gallon kits (each of Part A, Part B, Part C and Part D) in poly containers meeting UN requirements, unless otherwise specified

Quality and Deposits Characteristics

  • Pass >500 thermal shock cycles: -55⁰ to +125⁰C
  • Void-free fill of 10-20 mil through-holes of >2:1 aspect ratio
  • Excellent bond strength.
  • Low electrical resistivity.
  • Laser ablation can be used to pattern films 

Features and Benefits

  • Low cost metallization process
  • Low temperature metallization process
  • Permits laser ablation to fabricate metallization patterns with good resolution   
  • Process applicable to alumina, LTCC, HTCC and other dielectrics.

General Description

Low Temperature electroless copper metallizing process for alumina ceramics and other dielectric materials – strongly bonded copper can be plated, laser patterned, soldered, brazed or welded.

Safety and Documentation

Safety Information

Download Safety Data Sheet of Part A, Part B, Part C and Part D. Contact NANO3D SYSTEMS LLC for Certificate of Analysis.

SPECIFICATION (Rev. 1 051419)

ELN-EL14K-RTM-02

Electroless Copper Kit for Plating on Alumina Substrates

PLATING KIT FORMULATION:

 

 SURFACE ROUGHNENING

ETCHING

SILANIZATION

ACTIVATION 

ELECTROLESS COPPER DEPOSITION

MECHANICAL or CHEMICAL

SOLUTION A

SOLUTION B

SOLUTION C

SOLUTION D

     

SHELF LIFE:    These solutions have 12 months shelf life.

PACKAGINGThe standard Cu RTM kit ships in poly quarts and gallons for each of Part A, B, C and D. Larger packages are also available upon request.

Additional Info

APPLICATIONS

The low temperature electroless Copper (RTM) process is applicable to metallizing alumina substrates for power electronics, in hybrid and microcircuits, insulated heat skinks, ceramic tubes, windows and terminals. Strong bond structures are produced. Structures with hermetic seals are formed as well.

Cu RTM lends itself productively to the application of maskless patterning technology using laser to fabricate metallization patterns. In this manner, conductive pads may be formed for thin film and hybrid circuits.