$211.53 – $348.80
Part A in 1 quart and 1 gallon poly containers, Part B in 250 poly bottles and Part C in 20 ml glass bottles, meeting UN requirements, unless otherwise specified
Quality and Deposits Characteristics
Features and Benefits
Low Temperature electroless copper metallizing process for alumina ceramics, plastic substrates and other dielectric materials. Process permits additive manufacturing & 3D printing of metal patterns on various substrates.
Download Safety Data Sheet of Part A, Part B, Part C. Contact NANO3D SYSTEMS LLC for Certificate of Analysis.
SPECIFICATION (Rev. 1 020419)
Electroless Copper Kit for Spray Deposition
PLATING KIT FORMULATION:
Part A (Electroless Cu Stock) : Part B (Reducing Agent) : Part C (Catalyst) = 20 : 1 : 0.5
SHELF LIFE: These solutions have 12 months shelf life.
PACKAGING: The standard electroless Cu kit ships in poly quarts and gallons for Part A, 250 ml poly bottles for Part B and 20 ml glass bottles for Part C. Larger packages are also available upon request.
The low temperature electroless copper process is applicable for spray deposition of copper on dielectrics and metals substrates for applications in additive manufacturing.