Electroless Copper Plated Graphite Powder

$325.41$979.23

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SKU: ELNP-GCU-25A Category: .

Product Details

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Description

Packaging

25 and 100 grams containers, meeting UN requirements, unless otherwise specified.

Quality and Deposits Characteristics

  • Mass gain of graphite powder after plating of ~30%
  • Small copper grains
  • Low resistivity

Features and Benefits

  • Uniform copper plating on graphite
  • Conformal electroless Cu films
  • Continuous copper layer on the surface of graphite particles
  • The deepest recesses are well populated with copper grains

General description

Electroless Copper Plating of graphite powder is an electroless alkaline copper process engineered for activation and copper coating of graphite.

 
 

Safety & Documentation

Safety Information

Download Safety Data Sheet Contact NANO3D SYSTEMS LLC for Certificate of Analysis.


SPECIFICATION (Rev. 1 160627)

ELNP-GCU-25A
Electroless Copper Plated Graphite Powder

COMPOSITION: Copper coating of graphite powder (other plated metals such as Au, Ni et al are available upon request)

MASS GAIN:: ~30% after copper plating of graphite powder.

PACKAGING: 25 and 100 grams containers, meeting UN requirements, unless otherwise specified.

Additional Info

OPERATING CONDITIONS TO PREPARE PLATED GRAPHITE POWDER

1. Heat graphite at 380 °C for 1 hour.
2. Once cooled, the graphite was added to the sensibilization solution for 30 minutes.
3. The graphite and senisibilization solution was filtered and rinsed with DI water.
4. Graphite was dried in a vacuum oven for 10 minutes at 100 °C.
5. The graphite was added to an activation solution and sonicated for 30 minutes.
6. The graphite and activation solution was filtered again and rinsed with DI water.
7. The graphite was filtered again and rinsed. The filtered product was heated until the powder was dry.
8. The graphite was added to electroless copper solution for several hours to desired mass gain with sonication at 65 °C. The graphite was filtered and rinsed with water.
9. When dry, the graphite mass was compared to before plating to determine the amount of copper deposited.