Electroless Plateable TiOx-Pd Photoresist Kit

$227.45$517.96

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SKU: ELF-EL11K-CR-01 Category: .

Product Details

Description

Packaging

250 ml and 1 Liter poly bottles for Part A and B, 5 ml and 20 ml glass bottles for Part C, meeting UN requirements, unless otherwise specified.

Quality and Deposits Characteristics

  • Thickness < 50 nm with Pd nanoparticles < 5 nm
  • Conformal deposition
  • Good adhesion to substrates
  • Capable of patterning ˂ 5 μm features

Features and Benefits

  • Excellent to substrate adhesion
  • Strong adhesion of catalytic sites
  • Low processing temperatures (≤ 100 °C)
  • Capable of maskless patterning
  • Catalytic towards electroless Cu, Ni, Co, Ni-W-P, Co-W-P and other electroless metal deposition

General Description

Photopatternable Catalytic Resist is a spray-, dip-, or spin-deposited solution that can be patterned using UV-irradiation. The photopatterned catalytic resist is used for electroless deposition of various metals and metal alloys with feature sizes and spacings as small as ˂ 5 μm. NANO3D’s photopatternable catalytic resist can coat surfaces conformally, allowing high-resolution electroless metal deposition onto complex substrate geometries.

Safety and Documentation

Safety Information

Download Safety Data Sheet of Part A, Part B and Part C. Contact NANO3D SYSTEMS LLC for Certificate of Analysis.

SPECIFICATION (REV. 1 091017)

ELF-EL11K-CR-01

ELECTROLESS PLATEABLE TiOx-Pd PHOTORESIST KIT

PLATING KIT FORMULATION:

Plateable Catalytic Photoresist

Composition

Part A

titanium butoxide in IPA

Part B

oxalic acid in IPA

Part C

PdCl2/HCl in IPA

SHELF LIFE:    These solutions have 12 months shelf life.

Packaging: 250 ml and 1 L poly bottles for Part A and Part B, 5 ml and 20 ml glass bottles for Part C. Larger packages are available upon request.

Additional Information

PREPARATION PROCEDURE

  1. Substrate Cleaning: Substrates should be degreased by sonication in appropriate organic solvents. Degreasing should be followed by cleaning in air plasma. Plasma cleaning also improves adhesion of the solution to the substrate.
  2. Solution Mixing: The titanium butoxide (Part A) and oxalic acid (Part B) solutions should be mixed in a 1 to 1 ratio (v:v) 24 hours before use. The palladium chloride solution (Part C) should be added to the combined titanium butoxide/oxalic acid solution immediately prior to deposition to a titanium butoxide (Part A) : oxalic acid (Part B) : palladium chloride (Part C) solution ration of 1:1:0.02. For example, mix 100 ml Part A + 100 ml Part B + 2 ml Part C to prepare 202 ml catalytic photoresist.