Electroless Nickel Kit for Plating on Ceramics and Plastic Substrates

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SKU: ELN-EL9K-RTM-01 Category: .

Product Details

Description

Packaging

1 quart or 1 gallon kits (each of Part A, Part B, Part C and Part D) in poly containers meeting UN requirements, unless otherwise specified

Quality and Deposits Characteristics

  • Excellent bond strength – 100 psi typical.
  • Hardness of at least 500 (vickers) as deposited
  • Withstands temperature extremes – – 65o to + 850oC.
  • Passes Mil specifications for temperature cycling and shock.
  • Hermeticity – leak rate < 10—8cc helium/second.

Features and Benefits

  • Low cost metallization process
  • Low temperature metallization process
  • Permits registration of metallization patterns with good resolution using photolithographic techniques and mechanical masking.
  • Process applicable to beryllia, barium titanate, ferrites, epoxies, mylar and other dielectrics.

General Description

Low Temperature electroless nickel metallizing process for alumina ceramics, plastic substrates and other dielectric materials – strongly bonded nickel can be plated, soldered, brazed or welded.

Safety and Documentation

Safety Information

Download Safety Data Sheet of Part A, Part A for Plastics, Part B, Part C and Part D. Contact NANO3D SYSTEMS LLC for Certificate of Analysis.

SPECIFICATION (Rev. 1 020419)

ELN-EL9K-RTM-01

Electroless Nickel Kit for Plating on Ceramics and Plastic Substrates

PLATING KIT FORMULATION:

SURFACE

PRETREATMENT

BUFFERED

ETCH

SENSITIZER

AND

CONDITIONER

FIXING

ELECTROLESS NICKEL DEPOSITION

POLIMET

SOLUTION A

SOLUTION B

SOLUTION C

SOLUTION D

     

SHELF LIFE:    These solutions have 12 months shelf life.

PACKAGINGThe standard RTM kit ships in poly quarts and gallons for each of Part A, B, C and D. RTM Part A for Plastics (designed for plastics substrates vs. ceramics) ships in glass quarts and gallons. Larger packages are also available upon request.

Additional Info

APPLICATIONS

The low temperature electroless Nickel (RTM) process is applicable to metallizing alumina substrates in hybrid and microcircuits, insulated heat skinks, ceramic tubes, windows and terminals. Strong bond structures are produced. Structures with hermetic seals are formed as well.

The RTM process is also useful for metallizing barium titanate and ferrites. In addition, many polymeric materials, notable polyesters, epoxies, cellulosics, mylar and acrylonitrile-butadiene-styrene (ABS terpolymer) may be metallized following suitable modifications of the etch (Solution Part A).

RTM lends itself productively to the application of photolithographic technology using photo resist materials to register metallization patterns. In this manner, conductive pads may be formed for thin film and hybrid circuits. Base plates for building capacitor structures are also quite feasible.

GENERAL INSTRUCTIONS FOR THE RTM PROCESS

for CERAMIC and POLYMER SUBSTRATES

SUBSTRATES

PRETREATMENT

ETCH

SENSITIZER & CONDITIONER

FIXING

NICKEL DEPOSITION OPER.TEMP.

 

 

 

 

 

 

Alumina

Polimet or Equivalent

Solution A

Solution B

Solution C

Solution D

 

 

 

 

 

 

Beryllia

HF (1 1/2 min)

65 oC

 

 

 

 

 

 

Magnesium Oxide

Chromic Acid

(2 min.)

50 oC

 

 

 

 

 

 

Steatite

50 oC

 

 

 

 

 

 

Barium Titanate

Solution A     (2 min.)

65 oC

 

 

 

 

 

 

Ferrites

HCl 20%

(1 min.)

65 oC

 

 

 

 

 

 

Epoxies

Chromic Acid

(3 min.)

45 OC

 

 

 

 

 

 

Mylar

Chromic Acid

(3min.)followed with 25% KOH dip and rinse

45 oC

 

 

 

 

 

 

Polyethylene

45 oC

 

 

 

 

 

 

Polystyrene

45 oC

 

 

 

 

 

 

Lucite

25%

45 oC

 

 

 

 

 

 

Cellulose

Acetate

Chromic Acid

45 oC