Leveler Plating Additive

$194.38$332.76

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SKU: ELN-LS14-202A-01 Category: .

Product Details

Description

Packaging

500 ml and 1 liter poly bottles, meeting UN requirements, unless otherwise specified.

Quality and Characteristics

  • High planarization with no detectable recess on 1 – 10 µm wide x 0.5 – 2 µm deep trenches plated with 0.7 – 2 µm thick copper
  • Smooth plated copper surface with RMS </=10 nm  for 1 µm thick copper and RMS < 25 nm for ~ 20 µm thick copper films
  • Highly uniform (111) textures and minimal (200) and (220) textures at different plating rate of copper films and patterns
  • High suppression strength plating additive
  • Qualified bath metrology for replenishment 

Features and Benefits

  • Act as leveler and suppressor in copper electroplating solution
  • Stable additive with large process window
  • High purity and long shelf life

General description

Leveler plating additive is formulated to be used in copper electroplating solutions for high speed plating of copper bumps, pads, patterns and redistribution layers as well as void-free filling of vias and trenches on wide varieties of substrates including semiconductors, glass, polymers et al. Leveler enhances bottom-up fill and planarize the surface of plated copper in recessed features (vias and trenches) and eliminates dendrites formation during high speed plating. NANO3D’s Copper Electroplating process operates in wide range of current densities and provides excellent throwing power, improved leveling characteristics, and ductile low stress deposits. NANO3D copper electroplating processes produces bright copper deposits and smooth surface. Void-free fill of sub-20nm features with strong suppression strength additives (suppressor and leveler) with complete planarization and higher (111) texture to increase reliability and decrease defects (<10) for on-chip metallization.

Safety & Documentation

Safety Information

Download Safety Data Sheet. Contact NANO3D SYSTEMS LLC for Certificate of Analysis.

SPECIFICATION (Rev. 1 090308)

ELN-LS14-202A-01

Leveler LS14 for Copper Plating Solution

 

COMPOSITION:

 

SPECIFICATION

TEST method

      ASSAY

 

 

            LS14

2 ± 10 % a.u

HPLC

 

 

 

            Cu

0.5 ± 0.05 g/L

Spectrophotometry

 

 

 

      METALS

 

 

 

 

 

            Al    (Aluminum)

≤ 1 ppm

GFAA/ICPOES

            Au    (Au)

≤ 1 ppm

GFAA/ICPOES

            As    (Arsenic)

≤ 1 ppm

GFAA/ICPOES

            Ag    (Silver)

≤ 1 ppm

GFAA/ICPOES

            Ca    (Calcium)

≤ 1 ppm

GFAA/ICPOES

            Cd    (Cadmium)

≤ 1 ppm

GFAA/ICPOES

            Co    (Cobalt)

≤ 1 ppm

GFAA/ICPOES

            Cr    (Chromium)

≤ 1 ppm

GFAA/ICPOES

            Fe    (Iron)

≤ 1 ppm

GFAA/ICPOES

            In     (Indium)

≤ 1 ppm

GFAA/ICPOES

            Mg   (Magnesium)

≤ 1 ppm

GFAA/ICPOES

            Mn   (Manganese)

≤ 1 ppm

GFAA/ICPOES

            K     (Potassium)

≤ 1 ppm

GFAA/ICPOES

            Na    (Sodium)

≤ 1 ppm

GFAA/ICPOES

                    Ni            (Nickel)

≤ 1 ppm

GFAA/ICPOES

            Pb    (Lead)

≤ 1 ppm

GFAA/ICPOES

            Tl    (Thallium)

≤ 1 ppm

GFAA/ICPOES

            Zn    (Zinc)

≤ 1 ppm

GFAA/ICPOES

 

 

 

      Particles

 

 

            (> 0.25 mm)

≤ 200 counts/ml

Laser Particle Counter

SHELF LIFE:    12 months

PACKAGING:  500 ml and 1 liter polyethylene bottles. Other packages are available upon request

Additional Info

Leveler (L) suppresses Cu plating rate at the upper corners of recessed features (vias and trenches) and protrusions on the copper surface resulting in planarization and smooth surface of electroplated copper. LS14 leveler also enables ultra-fast (>5 µm/min copper bump plating with low WIWNU (<10%) and low WIDNU (± 3 % of target thickness).  High in-film purity (<10 ppm), low surface roughness and strong (111) texture, uniform and flat bumps improves the joint reliability for customer devices.