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$35.76 – $233.98
1 liter poly bottle, 1 gallon or 5 gallon pail, meeting UN requirements, unless otherwise specified.
Copper Sulfate Concentrate Solution is high purity electrolyte, semiconductor grade. It can be used to replenish our High Speed Bright Copper Electroplating Solution engineered for plating copper bumps, pads, patterns and redistribution layers as well as filling vias and trenches on wide varieties of substrates including semiconductors, glass, polymers et al. NANO3D’s High Speed Copper Electroplating process operates in wide range of current densities and provides excellent throwing power, improved levelling characteristics, and ductile low stress deposits. NANO3D copper electroplating processes produces bright copper deposits and smooth surface.
Download Safety Daa Sheet. Contact NANO3D SYSTEMS LLC for Certificate of Analysis.
COMPOSITION:
SPECIFICATION | TEST Method | |
ASSAY |
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| Copper | 69 ± 1 g/L | Titration |
Copper Sulfate Pentahydrate | 270 ± 5 g/L | Titration |
Specific Gravity | 1.16 – 1.17 | Hydrometer |
pH | 3 ± 0.5 g/L | pH meter |
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METALS |
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As (Arsenic) Bi (Bismuth) Ca (Calcium) | ≤ 0.2 ppm ≤ 0.2 ppm ≤ 0.25 ppm | ICPMS ICPMS ICPMS |
Cr (Chromium) Fe (Iron) | ≤ 0.15 ppm ≤ 0.6 ppm | ICPMS ICPMS |
Pb (Lead) Mn (Manganese) Ni (Nickel) | ≤ 0.1 ppm ≤ 0.1 ppm ≤ 0.3 ppm | ICPMS ICPMS ICPMS |
K (Potassium) | ≤ 0.5 ppm | ICPMS |
Se (Selenium) | ≤ 0.2 ppm | ICPMS |
Na (Sodium) Te (Tellurium) Sn (Tin) Zn (Zinc)
| ≤ 2 ppm ≤ 0.2 ppm ≤ 0.2 ppm ≤ 0.2 ppm
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ICPMS ICPMS ICPMS ICPMS
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SHELF LIFE: 24 months
PACKAGING: 1 liter poly bottle, 1 gallon or 5 gallon pail, meeting UN requirements, unless otherwise specified.
| Formulation of NANO3D’s High Speed Bright Copper Electroplating Solution* | Range: | Optimum: |
| Cu | 60 – 70 g/l | 65 g/l |
| H2SO4 | 6 – 10 g/l | 8 g/l |
| Chloride | 30 – 50 ppm | 40 ppm |
| Plating Additives | 300 – 900 ppm | 600 ppm |
| Temperature | 18 – 25°C | 22°C |
| Anode to cathode ratio | 2:1 to 3:1 | 2:1 |
| Cathode Current Density | 10 to 25 mA/cm2 (up to 400mA/cm2) | |
| Deposition Rate | ~0.15 – 0.37 µm/min @ 10 – 25 mA/cm2 (~5 µm/min @ 400 mA/cm2) | |
*NANO3D’s High Speed Bright Copper Electroplating Solution is manufactured by adding the proper amounts of sulphuric acid, hydrochloric acid and plating additives to NANO3D’s Copper Sulphate Concentrate Solution. The concentrations of inorganic components and metal trace impurities are reported on CofA’s for copper sulphate solution and high speed bright copper electroplating solution. To analyse and control the plating additives, please, contact NANO3D SYSTEMS LLC.
