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Copper Sulfate Concentrate Solution -
 

Copper Sulfate Concentrate Solution

$15.76$233.98

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SKU: EP-ECC-270A-01-SEMI Category: .

Product Details

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Description

Packaging

1 liter poly bottle, 1 gallon or 5 gallon pail, meeting UN requirements, unless otherwise specified.

Quality and Deposits Characteristics

  • Density of 8.9 g/cm3
  • Electrical resistivity of 1.7 – 1.8 µΩ cm
  • High in-film purity (<10 ppm for N, S, C, Cl)
  • Strong (111) texture with small (220) and (200)

Features and Benefits

  • High purity copper sulfate concentrate solution, 99.999%
  • Varieties of packages

General description

Copper Sulfate Concentrate Solution is high purity electrolyte, semiconductor grade. It can be used to replenish our High Speed Bright Copper Electroplating Solution engineered for plating copper bumps, pads, patterns and redistribution layers as well as filling vias and trenches on wide varieties of substrates including semiconductors, glass, polymers et al. NANO3D’s High Speed Copper Electroplating process operates in wide range of current densities and provides excellent throwing power, improved levelling characteristics, and ductile low stress deposits. NANO3D copper electroplating processes produces bright copper deposits and smooth surface.  

 
 

Safety & Documentation

Safety Information

Download Safety Daa Sheet. Contact NANO3D SYSTEMS LLC for Certificate of Analysis.


SPECIFICATION (Rev. 1 160429)

EP-ECC-270A-01-SEMI  

Copper Sulfate Concentrate Solution – Semiconductor Grade

 

COMPOSITION:              

 
SPECIFICATION

TEST Method

ASSAY

 

 

   
Copper69 ± 1 g/L

Titration

 Copper Sulfate Pentahydrate

270 ± 5 g/L

Titration

Specific Gravity

1.16 – 1.17

Hydrometer

pH

3 ± 0.5 g/L

pH meter

 

 

 

     METALS

 

 

 

 

 

                As   (Arsenic)

               Bi    (Bismuth)

               Ca   (Calcium)

≤  0.2 ppm

≤  0.2 ppm

≤  0.25 ppm

ICPMS

ICPMS

ICPMS

               Cr    (Chromium)

               Fe    (Iron)

≤ 0.15 ppm

≤ 0.6 ppm

ICPMS

ICPMS

               Pb    (Lead)

               Mn   (Manganese)

               Ni     (Nickel)

≤ 0.1 ppm

≤ 0.1 ppm

≤ 0.3 ppm

ICPMS

ICPMS

ICPMS

                 K      (Potassium)

≤ 0.5 ppm

ICPMS

                 Se     (Selenium)

≤ 0.2 ppm

ICPMS

               Na    (Sodium)

               Te    (Tellurium)

               Sn    (Tin)

               Zn    (Zinc)

 

≤ 2 ppm

≤ 0.2 ppm

≤ 0.2 ppm

≤ 0.2 ppm

 

 

ICPMS

ICPMS

ICPMS

ICPMS

 

 

 

 

 

SHELF LIFE:       24 months

 

PACKAGING:        1 liter poly bottle, 1 gallon or 5 gallon pail, meeting UN requirements, unless otherwise specified.

Additional Info

Formulation of NANO3D’s High Speed Bright Copper Electroplating Solution*Range:Optimum:
Cu60 – 70 g/l65 g/l
H2SO46 – 10 g/l8 g/l
Chloride30 – 50 ppm40 ppm
Plating Additives300 – 900 ppm600 ppm
Temperature18 – 25°C22°C
Anode to cathode ratio2:1 to 3:12:1
Cathode Current Density10 to 25 mA/cm2 (up to 400mA/cm2)
Deposition Rate~0.15 – 0.37 µm/min @ 10 – 25 mA/cm2 (~5 µm/min @ 400 mA/cm2)

 

*NANO3D’s High Speed Bright Copper Electroplating Solution is manufactured by adding the proper amounts of sulphuric acid, hydrochloric acid and plating additives to NANO3D’s Copper Sulphate Concentrate Solution. The concentrations of inorganic components and metal trace impurities are reported on CofA’s for copper sulphate solution and high speed bright copper electroplating solution. To analyse and control the plating additives, please, contact NANO3D SYSTEMS LLC.