$279.94 – $439.81
Description
Packaging
1 quart or 1 gallon kits (each of Part A, Part B, Part C and Part D) in poly containers meeting UN requirements, unless otherwise specified
Quality and Deposits Characteristics
Features and Benefits
General Description
Low Temperature electroless nickel metallizing process for alumina ceramics, plastic substrates and other dielectric materials – strongly bonded nickel can be plated, soldered, brazed or welded.
Safety Information
Download Safety Data Sheet of Part A, Part A for Plastics, Part B, Part C and Part D. Contact NANO3D SYSTEMS LLC for Certificate of Analysis.
SPECIFICATION (Rev. 1 020419)
ELN-EL9K-RTM-01
Electroless Nickel Kit for Plating on Ceramics and Plastic Substrates
PLATING KIT FORMULATION:
SURFACE PRETREATMENT | BUFFERED ETCH | SENSITIZER AND CONDITIONER | FIXING | ELECTROLESS NICKEL DEPOSITION |
POLIMET | SOLUTION A | SOLUTION B | SOLUTION C | SOLUTION D |
SHELF LIFE: These solutions have 12 months shelf life.
PACKAGING: The standard RTM kit ships in poly quarts and gallons for each of Part A, B, C and D. RTM Part A for Plastics (designed for plastics substrates vs. ceramics) ships in glass quarts and gallons. Larger packages are also available upon request.
APPLICATIONS
The low temperature electroless Nickel (RTM) process is applicable to metallizing alumina substrates in hybrid and microcircuits, insulated heat skinks, ceramic tubes, windows and terminals. Strong bond structures are produced. Structures with hermetic seals are formed as well.
The RTM process is also useful for metallizing barium titanate and ferrites. In addition, many polymeric materials, notable polyesters, epoxies, cellulosics, mylar and acrylonitrile-butadiene-styrene (ABS terpolymer) may be metallized following suitable modifications of the etch (Solution Part A).
RTM lends itself productively to the application of photolithographic technology using photo resist materials to register metallization patterns. In this manner, conductive pads may be formed for thin film and hybrid circuits. Base plates for building capacitor structures are also quite feasible.
GENERAL INSTRUCTIONS FOR THE RTM PROCESS
for CERAMIC and POLYMER SUBSTRATES
SUBSTRATES | PRETREATMENT | ETCH | SENSITIZER & CONDITIONER | FIXING | NICKEL DEPOSITION OPER.TEMP. |
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Alumina | Polimet or Equivalent | Solution A | Solution B | Solution C | Solution D |
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Beryllia | “ | HF (1 1/2 min) | “ | “ | 65 oC |
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Magnesium Oxide | “ | Chromic Acid (2 min.) | “ | “ | 50 oC |
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Steatite | “ | “ | “ | “ | 50 oC |
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Barium Titanate | “ | Solution A (2 min.) | “ | “ | 65 oC |
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Ferrites | “ | HCl 20% (1 min.) | “ | “ | 65 oC |
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Epoxies | “ | Chromic Acid (3 min.) | “ | “ | 45 OC |
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Mylar | “ | Chromic Acid (3min.)followed with 25% KOH dip and rinse | “ | “ | 45 oC |
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Polyethylene | “ | “ | “ | “ | 45 oC |
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Polystyrene | “ | “ | “ | “ | 45 oC |
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Lucite | “ | 25% | “ | “ | 45 oC |
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Cellulose Acetate | “ | Chromic Acid | “ | “ | 45 oC |