Services


Proof-of-Concept & Process Development

Is electroless plating or electroplating right for your application? Can it replace slower, more expensive or less adaptable deposition methods in your manufacturing process? Exploring new options, like unusual substrate-metal combinations? Nano3D Systems can work with you to prove a concept or establish an appropriate metallization process. In addition to our facilities at the Advanced Technolog and Manufacturing Institute (ATAMI) in Corvallis, OR, Nano3D Systems benefits from access to nearby universities and relationships with industrial partners who focus on different aspects of high-tech manufacturing.

Your project, your rules.

A research and development project is a problem with many faces, with issues ranging from cost and feasibility to intellectual property issues and confidentiality. Nano3D Systems understands these concerns amd can work with you to develop a project that will deliver results on your terms.


Physical and Chemical Analysis Services

Thin Films Materials Characterization Services

Physical and chemical analysis of freestanding metal foils and thin films on various substrates. Determine film purity, alloy composition, surface roughness, and thermal and mechanical properties.

Chemical Analysis Services

Analytical services to assist in method development and quality control.

Available Techniquess

Titrations

  • Acid-base
  • Redox
  • Precipitation
  • Complexometric

Spectroscopy

  • UV-VIS
  • FT-IR
  • Secondary Ion Mass (SIMS)
  • Energy Dispersive X-Ray (EDX)

Surface characterization

  • Profilometry
  • Optical microscopy
  • Scanning electron microscopy (with or without EDX)
  • Atomic force microscopy

Physical Analysis

  • Internal stress
  • Film-substrate adhesion
  • Differential Scanning Calorimetry (DSC)
  • Linear thermal expansion & thermal conductivity

Chemical Analysis

  • IC/HPLC
  • Voltammetry/CVS

News

More news & events...

Technical Data Sheets & Safety Data Sheets

Contact Nano3D Systems for information on the following products:
  • High-Speed Bright Copper Electroplating Solution
  • Low-Stress Invar Electroplating Solution
  • High-Resolution TiOx-Pd Photoresist
  • Conformal Barrier Electroless Nickel Plating Solution
  • Conformal Barrier Electroless Cobalt Plating Solution
  • Low-Resistivity Electroless Copper Plating Solution


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