Val Dubin holds a Ph.D. degree in microelectronics and an M.S. degree in electrical engineering as well as a Doctor of Science degree in nanotechnology and nanomaterials from the University of Informatics and Electronics (Belarus). He completed his post-doctoral study at Aarhus University (Denmark). Dr. Dubin was a researcher at Ecole Polytechnique (France) and visiting scientist at Cornell University (USA).
Dr. Dubin has over 20 years of industrial experience. Among his most notable accomplishments was leading the successful revolutionary transition from aluminum to copper metallization at the two largest semiconductor logic manufacturers – Intel and AMD. He managed the electroplating group in Fab 20 at Intel (appox. 50 Engs and Techs) and the R&D metallization group (10 PhD Engineers) at Components Research with responsibility spanning early development to pilot production and mass production.
Dr. Dubin founded, organized, staffed, managed and raised over $8M for two startups including EMAT Technology LLC and NANO3D SYSTEMS LLC. He established strategic partnerships with leading process tool suppliers and materials companies, engaged customers including the world’s largest semiconductor, airspace and chemical materials companies, leading to growing sales of NANO3D process materials and services to customers.
Dr. Dubin served on the Board of Directors of R&D consortiums including CCMC (Univ. of New Mexico, Sandia National Lab, Penn State Univ., Rutgers Univ.), NSEC (nano-center Columbia University), as well as managing work on metallization at IMEC (Belgium) for Intel.
Dr. Dubin has nearly 300 publications including 52 journal papers, 101 conference papers, 5 chapters in the books and 142 patents. He has numerous awards for his professional achievements including an Intel Achievement Award.