NANO3D SYSTEMS is pleased to be nominated to the 2017 World Materials Forum Start Up Challenge. We see this nomination as an opportunity for our eLOCOS(TM) plating technology to be part of WMF’s mission to achieve the objective of materials efficiency for better growth with materials/IOT industry leaders throughout the world.World Materials Forum (WMF) was held on June 29 - 30th in Nancy, France. This year forum includes about 260 invited C–suite participants in materials / IOT companies throughout the world. It’s different than conventional industry forums – only thought leaders and company executives across industries driving new technologies for sustainability. This leads to a fascinating network and information flow.
WMF asked Nano3D Systems’ president Val Dubin to describe Nano3D’s breakthrough technology and its contribution to the WMF Overall Objective of “Material Efficiency for Better Growth.” Dr. Dubin’s response was:
“NANO3D provides revolutionary eLOCOS metallization technology for advanced 3D devices. NANO3D addresses $15.3B metal plating market opportunity that needs advanced plating technology to decrease the interconnect feature sizes and increase the power density for next generation consumer and power electronic devices.
NANO3D’s patented eLOCOS plating technology is based on novel materials and enables: a) drastically increase the interconnect density by selectively plating ultra-small features of high aspect ratios to reduce the form factor, and b) fabricate controlled expansion interconnects by plating alloys with unique properties to eliminate CTE mismatch between buildup materials.
We partner with major plating tool suppliers and R&D consortiums to qualify NANO3D’s process technology and plating chemicals, and then scale up the production of materials through toll manufacturing and licensing to established chemical companies.
NANO3D additive metallization technology drastically reduces the usage of copper and polishing slurry to fabricate multichip interconnects to enable small form factor, affordable and reliable 3D microsystems. “
Two of Nano3D System's newest projects were presented at the 231st Electrochemical Society Meeting in New Orleans, LA. "Selective Plating on Flexible Glass and Polymer Substrates with Laster Drilled Holes" showcased Nano3D's flagship catalytic photoresist at its most versatile. The same laser can be used to both drill vias into a substrate and pattern the photoresist, while the resist is suitable for both promoting electroless deposition inside the via and generating clean, well-defined fine patterns on the substrate surface.
"Photopatternable, Electrochemically Plated Conductive Fabrics" used a modified 1-step Sn/Pd activator to generate photopatterned conductive features on cotton substrates. This process starts with commercially available cotton fabrics and ends with a flexible circuit with minimnal processing or damage to the substrate. Papers detailing both the plated fabric and selective plating/laser drilling can be found in the 231st ECS Meeting Transactions.
Nano3D Systems, LLC is engaged in a Small Business/ERC Collaborative Opportunity (SECO) with the Center for Power Optimization of Electro-Thermal Systems as an extension of its current NSF SBIR Phase II project, "Low cost, scalable and selective electrochemical metallization process technology." The collaboration will advance NANO3D’s eLOCOS(TM) platform technology in novel applications of 3D electro-thermal systems for the reduction of energy consumption in the transportation industry.
Over 25% of the energy consumed by the United States goes towards transportation, and a great majority of the money spent on this energy is spent on fossil fuels. By increasing the power density of mobile electrified systems, the Center for Power Optimization of Electro-Thermal Systems (POETS) wants to conserve nearly 80 million gallons of fuel per year from on-highway vehicle usage alone. The widespread adoption of electrified vehicles will produce both immediate and long-term economic and environmental benefits. In order to gain acceptance, electrified vehicles need to be competitive both in performance and costs to petroleum-powered cars & trucks.
The technical challenges posed by POETS goal are substantial, and Nano3D Systems believes eLOCOS(TM) solutions can play an integral role in the development of power-dense mobile electrified systems. In the short term, Nano3D Systems provides access to unique plating formulas and cost-reducing conformal plating technology. POETS consortium members now have a ready source of customizable, high-tech metallization options, including the Invar, an alloy whose physical properties are particularly suited to address the challenges inherent to thermally-limited systems. POETS explicit mission is to commercialize the results of successful research projects and Nano3D Systems' facilitates the lab-to-production transition by the commitment to scalability and cost containment that is built into the eLOCOS(TM) system.
Invar Electroplating for Controlled Expansion Interconnects presented at the 230th ECS Meeting in Honolulu, HI
ONAMI GAP Project with University of Oregon on “Characterization of Self-Assembled Catalytic Nanolayers and Selective Electroless Adhesion/Barrier Layers” was successfully completed .
“Technology Enhancement for Commercial Partnership – TECP” project with ClassOne Technology Inc. on INVAR plating was successfully completed as supplemental support to NSF SBIR Phase II project.
- High-Speed Bright Copper Electroplating Solution
- Low-Stress Invar Electroplating Solution
- High-Resolution TiOx-Pd Photoresist
- Conformal Barrier Electroless Nickel Plating Solution
- Conformal Barrier Electroless Cobalt Plating Solution
- Low-Resistivity Electroless Copper Plating Solution