Selected Applications

eLOCOS(TM) 2.5D and 3D high density interconnects (with market of $18.1B by Y2020) allows for the creation of new chipset architectures for future generations of mobile- and server-class processors as well as RF, MEMS, Optical, CIS, IoT devices. eLOCOS(TM) electroless metal photo-patterning technology enables the manufacture of large-area flexible PCB’s with plated through holes aimed at the $15.2B flexible PCB market by Y2020. eLOCOS(TM) controlled expansion metallization of 3D electro-thermal systems enable the devices that can withstand high thermal stress and high temperatures, neccessities for the $75B transportation market.

Selective Plating for Semiconductor and Microfabrication Applications



Plating of Blind Vias and Through-Holes

Electronic devices are made compact and powerful by packing ever-shrinking components onto integrated circuit boards as densely as possible. Still, there are practical limits to how much processing power can be squeezed onto the classic planar circuit board. 3D integrated circuits will allow manufacturers of electronic components to continue making affordable devices smaller and more powerful. Nano3D Systems eLOCOS(TM) plating solutions can fill blind and through-holes completely, uniformly and efficiently, critical for the wide-scale adaption of 3D integrated circuits.

Electroless metal photo-patterning

3D metallization may be the future, but 2D patterning is not going anywhere. Use eLOCOS(TM) solutions to make thin films for etching, or plate selectively by patterning your substrate at the activation step. Use your own processes or Nano3D Systems' proprietary catalytic photoresist. Plate high-density features on silicon wafers, glass or polymer substrates. Temperature restrictions? pH problems? Let Nano3D Systems help you to find the right process for your situation.

INVAR Plating

Need interconnect and coatings on your devices withstand high thermal-mechanical stress? Or tune composition and thermal-mechanical properties of Ni-Fe alloys? Match plated metal CTE to substrate CTE? Let NANO3D Systems help you to produce uniform, low-internal-stress and controlled-expansion nickel iron alloy films deposited on different substrates to fabricate redistribution layers, through silicon vias interconnects, plated though-holes, pillars, bumps, pads, coatings and free standing foils.

Other Plating Applications

Conformal plating of metallic shells on non-metallic particles. Novel nano- and micro-materials with unique properties can be fabricated by conformally plating metals on non-metallic particles. Metal plated graphite particles with low resistivity metals combine high electrical resistance with low weight while metal plated phase-change materials have high thermal capacity and increased thermal conductivity.

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Technical Data Sheets & Safety Data Sheets

Contact Nano3D Systems for information on the following products:
  • High-Speed Bright Copper Electroplating Solution
  • Low-Stress Invar Electroplating Solution
  • High-Resolution TiOx-Pd Photoresist
  • Conformal Barrier Electroless Nickel Plating Solution
  • Conformal Barrier Electroless Cobalt Plating Solution
  • Low-Resistivity Electroless Copper Plating Solution


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